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L9348

STMicroelectronics

L9348 by STMicroelectronics

L9348 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V, supporting up to 5A output current. It features built-in protections against transients, overcurrent, and thermal issues. Ideal for automotive and industrial applications, it ensures reliable performance in compact designs.

Median Price

$5.650

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 49 parts In-Stock

1+ parts

$5.650

100+ parts

$3.922

1k+ parts

-

10k+ parts

-

49

$5.650

$3.922

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 599 parts In-Stock

1+ parts

$5.956

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$5.956

-

-

-

Vyrian

USA . 7,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,077

-

-

-

-

Anansix

USA . 2,843 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,843

-

-

-

-

Bristol Electronics

USA . 23 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 310 parts In-Stock

1+ parts

$4.660

100+ parts

-

1k+ parts

-

10k+ parts

-

310

$4.660

-

-

-

Corphita

USA . 2,357 parts In-Stock

1+ parts

$5.643

100+ parts

-

1k+ parts

-

10k+ parts

-

2,357

$5.643

-

-

-

IDEA Electronic Components Group

UK . 1,922 parts In-Stock

1+ parts

$7.853

100+ parts

-

1k+ parts

$7.068

10k+ parts

-

1,922

$7.853

-

$7.068

-

MKK Technologies

India . 2,241 parts In-Stock

1+ parts

$14.767

100+ parts

-

1k+ parts

-

10k+ parts

-

2,241

$14.767

-

-

-

DigiPath Technology Company

USA . 2,241 parts In-Stock

1+ parts

$14.767

100+ parts

-

1k+ parts

-

10k+ parts

-

2,241

$14.767

-

-

-

Microchip USA

USA . 236 parts In-Stock

1+ parts

$17.388

100+ parts

-

1k+ parts

-

10k+ parts

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236

$17.388

-

-

-

Parana Technologies

USA . 1,978 parts In-Stock

1+ parts

-

100+ parts

$9.390

1k+ parts

-

10k+ parts

-

1,978

-

$9.390

-

-

Perfect Parts

USA . 347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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347

-

-

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-

Overview

Elevate your designs with the L9348 from STMicroelectronics, a cutting-edge peripheral driver that combines exceptional reliability with advanced built-in protections against transients, overcurrent, and thermal stress. With its compact yet powerful architecture, this driver is perfect for a multitude of applications, ensuring seamless performance and reduced downtime. Choose the L9348 for unparalleled quality and support from a trusted leader in semiconductor innovation, empowering your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCB layouts.

Maximum Supply Voltage: 18 V

A high maximum supply voltage offers flexibility in design, allowing it to work with a range of power supply options.

No. of Functions: 4

With four functions, this product can handle multiple tasks simultaneously, providing versatile performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space usage on printed circuit boards.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

These built-in protections enhance the reliability and longevity of the product by safeguarding it against common electrical issues.

Power Supplies (V): 4.8/18

Supporting a wide range of power supply voltages increases compatibility with various systems.

No. of Terminals: 36

A greater number of terminals enables more connections, facilitating integration with complex circuits.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline package style is ideal for high-density applications where space is limited.

Minimum Supply Voltage: 4.8 V

A minimum supply voltage of 4.8 V allows it to function in low-voltage applications, expanding its usability.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish offers excellent solderability and resistance to oxidation, ensuring reliable performance.

Terminal Position: DUAL

Dual terminal position enables versatile mounting options and simplifies PCB layout.

Maximum Seated Height: 3.6 mm

Low profile minimizes board space requirements, allowing for more compact designs.

Width: 11 mm

With a width of 11 mm, it strikes a balance between compact size and sufficient connectivity.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, it’s designed for compatibility with standard soldering processes.

Peak Reflow Temperature °C: 245

The specified peak temperature ensures compatibility with common reflow soldering techniques.

Length: 15.9 mm

The length is optimized for various applications while maintaining a compact form factor.

Maximum Output Current: 5 A

A maximum output current of 5 A allows it to drive significant loads, making it suitable for power-intensive applications.

Technology: BCD

BCD technology enhances efficiency and reduces power consumption, valuable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and solder joint reliability.

Turn-on Time: 20 us

Fast turn-on time improves responsiveness in time-sensitive applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density connections while ensuring manufacturability.

Driver No. of Bits: 4

Having a 4-bit driver allows for precise control and efficient communication in digital applications.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates it can withstand some exposure to moisture, making it suitable for various manufacturing processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This classification provides versatility in applications, being able to serve multiple purposes as a driver.

Turn-off Time: 30 us

A turn-off time of 30 us ensures efficient transitions in dynamic applications, improving overall performance.

Output Current Flow Direction: SOURCE

Source current flow direction allows for straightforward interfacing with other components in a circuit.

Technical Specifications

Peripheral Drivers L9348 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Output Current Flow Direction:

SOURCE

Maximum Output Current:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

4.8/18

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

4.8 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

30 us

Turn-on Time:

20 us

Width:

11 mm

Trade Compliance

L9348 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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