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L9348-TR

STMicroelectronics

L9348-TR by STMicroelectronics

L9348-TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 18V, supporting up to 5A output current. It features built-in protections against transients, overcurrent, and thermal issues. Ideal for applications requiring robust control in compact designs, it comes in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,252

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-

-

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Digiode

USA . 1,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,756

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-

-

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Anansix

USA . 901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

901

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 760 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

-

10k+ parts

-

760

$0.500

-

-

-

Microchip USA

USA . 360 parts In-Stock

1+ parts

$9.223

100+ parts

-

1k+ parts

-

10k+ parts

-

360

$9.223

-

-

-

IDEA Electronic Components Group

UK . 1,922 parts In-Stock

1+ parts

$12.797

100+ parts

-

1k+ parts

$11.517

10k+ parts

-

1,922

$12.797

-

$11.517

-

AZTECH Wire

Italy . 605 parts In-Stock

1+ parts

$18.170

100+ parts

-

1k+ parts

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10k+ parts

-

605

$18.170

-

-

-

MKK Technologies

India . 1,861 parts In-Stock

1+ parts

$24.064

100+ parts

-

1k+ parts

-

10k+ parts

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1,861

$24.064

-

-

-

DigiPath Technology Company

USA . 1,861 parts In-Stock

1+ parts

$24.064

100+ parts

-

1k+ parts

-

10k+ parts

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1,861

$24.064

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-

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Vigor

Singapore . 7,425 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,425

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-

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Corphita

USA . 2,254 parts In-Stock

1+ parts

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2,254

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Parana Technologies

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$15.301

1k+ parts

-

10k+ parts

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10

-

$15.301

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Overview

Elevate your projects with the L9348-TR from STMicroelectronics, a top-tier peripheral driver that combines reliability and innovation. With robust built-in protections against transients, overcurrent, and thermal risks, this compact powerhouse ensures your applications run smoothly and efficiently. Perfect for automotive and industrial uses, its versatile performance allows you to drive multiple functions while enjoying peace of mind—unlocking unparalleled value for your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it ideal for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and simplifies assembly processes.

Maximum Supply Voltage: 18 V

With a high maximum supply voltage, this driver can handle a wide range of applications with varying power requirements.

No. of Functions: 4

The product offers multiple functions, making it versatile and able to cater to diverse operational needs.

Package Shape: RECTANGULAR

The rectangular package shape supports easy integration into various designs and product configurations.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections enhance reliability and safety, preventing damage to the device under abnormal conditions.

Power Supplies (V): 4.8/18

This wide voltage range allows for flexibility in system design and compatibility with different power sources.

No. of Terminals: 36

A higher number of terminals provides increased connectivity options for more complex circuitry.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design are beneficial for compact devices, enhancing space management on PCBs.

Minimum Supply Voltage: 4.8 V

The low minimum supply voltage allows for operation in a variety of low-power applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and provides good corrosion resistance, ensuring a reliable connection.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility, making it easier to incorporate into different designs.

Maximum Seated Height: 3.6 mm

A low seated height is ideal for low-profile applications, allowing for thinner device profiles.

Width: 11 mm

The compact width supports easier integration into space-constrained designs.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds allows for efficient manufacturing processes while ensuring component integrity.

Peak Reflow Temperature °C: 245

A high peak reflow temperature supports a variety of solder types, broadening manufacturing options.

Length: 15.9 mm

The relatively short length contributes to a compact design, making it suitable for small electronic devices.

Maximum Output Current: 5 A

A high output current capability enables support for power-hungry devices and applications.

Technology: BCD

BCD technology provides enhanced performance and efficiency, making it suitable for modern applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability in mounted applications.

Turn-on Time: 20 us

A quick turn-on time enhances responsiveness in applications, improving overall system performance.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows increased terminal density, maximizing PCB space efficiency.

Driver No. of Bits: 4

The 4-bit driver capability allows for control of multiple outputs, enhancing functional versatility.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity, ensuring proper handling and storage practices are followed.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter based driver supports a wide range of interfacing options, enhancing system compatibility.

Turn-off Time: 30 us

A fast turn-off time helps in minimizing power loss and enhances overall efficiency in the system.

Output Current Flow Direction: SOURCE

Source current flow simplifies driving external loads, ensuring straightforward component integration.

Technical Specifications

Peripheral Drivers L9348-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

36

Output Current Flow Direction:

SOURCE

Maximum Output Current:

5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

4.8/18

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

4.8 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

30 us

Turn-on Time:

20 us

Width:

11 mm

Trade Compliance

L9348-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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