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L9349

STMicroelectronics

L9349 by STMicroelectronics

L9349 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and supports up to 4 functions. It features built-in transient and thermal protections, making it ideal for automotive applications. With a compact design, it delivers an output current of 3A efficiently.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,699 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,699

-

-

-

-

Anansix

USA . 2,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,341

-

-

-

-

Vyrian

USA . 1,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,463

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$10.551

100+ parts

-

1k+ parts

$9.496

10k+ parts

-

1,122

$10.551

-

$9.496

-

MKK Technologies

India . 1,706 parts In-Stock

1+ parts

$19.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,706

$19.840

-

-

-

DigiPath Technology Company

USA . 1,706 parts In-Stock

1+ parts

$19.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,706

$19.840

-

-

-

Parana Technologies

USA . 1,705 parts In-Stock

1+ parts

-

100+ parts

$12.615

1k+ parts

-

10k+ parts

-

1,705

-

$12.615

-

-

Kepictronics

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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900

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-

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Corphita

USA . 389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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389

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Overview

Unlock the potential of your applications with the L9349 from STMicroelectronics—where quality meets innovation. This versatile peripheral driver, designed for seamless integration, excels in reliability and efficiency, ensuring your systems perform at their best. With built-in protections against transients and thermal issues, you gain peace of mind. Ideal for automotive and industrial uses, the L9349 delivers unmatched value, empowering you to elevate your projects with confidence and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

The surface mount design allows for efficient space utilization on PCBs, enabling compact product designs.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage, this peripheral driver can be used in diverse electronic applications.

No. of Functions: 4

Multiple functions enhance versatility, allowing for various signal management tasks in one device.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and heat dissipation, crucial for performance in confined spaces.

Built-in Protections: TRANSIENT; THERMAL

Integrated transient and thermal protections increase reliability and prevent damage in harsh operating conditions.

Power Supplies (V): 4.5/32

Wide operating voltage range supports a variety of supply levels, accommodating different system requirements.

No. of Terminals: 20

A larger number of terminals allows for more connections, enhancing final product functionality and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to soldering efficiency and space-saving designs in electronics.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage makes it compatible with battery-operated devices and energy-efficient applications.

Terminal Finish: TIN LEAD

Tin-lead finishes offer good solderability and conductivity, improving assembly reliability.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and helps optimize space while maintaining signal integrity.

Maximum Seated Height: 3.6 mm

Low seated height reduces the overall profile of assembled boards, ideal for compact designs.

Width: 11 mm

Compact width makes this device ideal for tight spaces in modern electronics.

Length: 15.9 mm

Short length supports better space management on PCB boards, maximizing layout efficiency.

Maximum Output Current: 3 A

High output current capability allows the driver to manage substantial loads, enhancing its application scope.

Technology: BCD

BCD technology ensures high efficiency and integration, which is crucial for reducing system complexity.

Terminal Form: GULL WING

Gull wing terminal design offers excellent mechanical stability and soldering reliability.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V is common in many applications, making it highly compatible with existing systems.

Turn-on Time: 25 us

Fast turn-on time enhances responsiveness in applications, ensuring quick signal transmissions.

Terminal Pitch: 1.27 mm

A standard terminal pitch aids in compatibility with existing designs, facilitating easier integration.

Driver No. of Bits: 4

4-bit capability allows for processing of multiple signals simultaneously, improving efficiency in data handling.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type allows for effective signal manipulation, making it suitable for various peripheral applications.

Turn-off Time: 30 us

Quick turn-off time improves power efficiency and minimizes signal latency in critical applications.

Output Current Flow Direction: SINK

The sink current capability is beneficial for controlling outputs, enabling effective signal regulation in circuits.

Technical Specifications

Peripheral Drivers L9349 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

25 us

Width:

11 mm

Trade Compliance

L9349 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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