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L9349-TR

STMicroelectronics

L9349-TR by STMicroelectronics

L9349-TR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and built-in transient and thermal protections. It features 4 functions, operates b/w 4.5V to 32V, and has a compact SO package. Ideal for automotive applications requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 698 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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698

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-

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Anansix

USA . 640 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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640

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Vyrian

USA . 344 parts In-Stock

1+ parts

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344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$11.335

100+ parts

-

1k+ parts

$10.202

10k+ parts

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910

$11.335

-

$10.202

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MKK Technologies

India . 641 parts In-Stock

1+ parts

$21.315

100+ parts

-

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641

$21.315

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DigiPath Technology Company

USA . 641 parts In-Stock

1+ parts

$21.315

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$21.315

-

-

-

Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

-

100+ parts

$13.553

1k+ parts

-

10k+ parts

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1,294

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$13.553

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Corphita

USA . 948 parts In-Stock

1+ parts

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948

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Overview

Unlock superior performance with the L9349-TR from STMicroelectronics, a trusted leader in innovation. This versatile peripheral driver excels in demanding applications, offering robust thermal and transient protection to ensure reliability. With its compact design and efficient operation, it enhances system responsiveness while reducing energy consumption. Elevate your projects with the quality assurance of STMicroelectronics and experience the difference in performance and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, enabling more compact designs and easier automated assembly.

Maximum Supply Voltage: 32 V

A high maximum supply voltage provides flexibility in applications, allowing the product to be used in a wide range of systems.

No. of Functions: 4

With four functions, this product can perform multiple tasks, reducing the need for additional components and saving on board space.

Package Shape: RECTANGULAR

The rectangular shape is optimal for efficient layout on circuit boards, facilitating better integration into electronic designs.

Built-in Protections: TRANSIENT; THERMAL

Built-in transient and thermal protections enhance reliability and protect the device from voltage spikes and overheating, increasing overall lifespan.

No. of Terminals: 20

Having 20 terminals allows for versatile connections, ensuring compatibility with various circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE

Small outline packages save space and are well-suited for modern compact electronic devices, allowing for efficient use of PCB real estate.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage expands its usability in low-power applications, making it energy efficient.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit board design, enabling various layout options for easier assembly.

Maximum Seated Height: 3.6 mm

A low seated height is advantageous for low-profile designs, contributing to slim product profiles and better integration into compact devices.

Width: 11 mm

An 11 mm width contributes to an overall compact design, fitting easily into tight spaces in modern electronics.

Length: 15.9 mm

The length of 15.9 mm ensures compatibility with standard PCB layouts, simplifying design requirements.

Technology: BCD

BCD technology offers high efficiency and reliability in driving peripherals, making it suitable for various applications in consumer and industrial electronics.

Terminal Form: GULL WING

Gull wing terminals ensure stronger mechanical connections and better soldering quality, enhancing reliability in assembly.

Nominal Supply Voltage: 12 V

A nominal supply voltage of 12 V makes it suitable for a range of applications, particularly in automotive and industrial systems.

Turn-on Time: 25 us

A quick turn-on time of 25 microseconds enhances responsiveness in peripheral applications, improving overall performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for dense packing of components while maintaining ease of handling during placement and soldering.

Turn-off Time: 30 us

A fast turn-off time of 30 microseconds ensures efficient power management and reduces latency in control signals.

Output Current Flow Direction: SINK

The ability to sink current makes this driver effective for controlling various types of loads, providing versatility in application.

Technical Specifications

Peripheral Drivers L9349-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

30 us

Turn-on Time:

25 us

Width:

11 mm

Trade Compliance

L9349-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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