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L9338DTR

STMicroelectronics

L9338DTR by STMicroelectronics

L9338DTR by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and built-in protections against transients, overcurrent, and thermal issues. It features 4 functions in a compact 20-terminal package. Ideal for automotive and industrial applications requiring reliable control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,148 parts In-Stock

1+ parts

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6,148

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ComSIT Distribution GmbH

Germany . 3,255 parts In-Stock

1+ parts

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3,255

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Anansix

USA . 1,519 parts In-Stock

1+ parts

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1,519

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Digiode

USA . 1,386 parts In-Stock

1+ parts

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1,386

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 868 parts In-Stock

1+ parts

$5.764

100+ parts

-

1k+ parts

$5.187

10k+ parts

-

868

$5.764

-

$5.187

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Microchip USA

USA . 420 parts In-Stock

1+ parts

$7.419

100+ parts

-

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420

$7.419

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MKK Technologies

India . 1,583 parts In-Stock

1+ parts

$10.838

100+ parts

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1,583

$10.838

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DigiPath Technology Company

USA . 1,583 parts In-Stock

1+ parts

$10.838

100+ parts

-

1k+ parts

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10k+ parts

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1,583

$10.838

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-

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AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$13.130

100+ parts

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712

$13.130

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Vigor

Singapore . 8,910 parts In-Stock

1+ parts

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8,910

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Corphita

USA . 2,813 parts In-Stock

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2,813

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Parana Technologies

USA . 664 parts In-Stock

1+ parts

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100+ parts

$6.892

1k+ parts

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664

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$6.892

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Overview

Unlock the potential of your projects with the L9338DTR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility, this peripheral driver excels in demanding applications, offering reliable performance with built-in protections against transient spikes and thermal issues. Enhance efficiency and streamline your designs while benefiting from ST's commitment to quality and excellence. Experience superior driving capabilities that elevate your creations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robustness and protection against environmental factors, contributing to device longevity.

Surface Mount: YES

Surface mount technology facilitates a compact design, allowing for easier integration into modern PCBs and high-density applications.

Maximum Supply Voltage: 32 V

A high maximum supply voltage provides flexibility in applications and compatibility with a wide range of power systems.

No. of Functions: 4

Having four functions enhances versatility, enabling the driver to perform multiple tasks within a single unit, thus saving space and cost.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space and facilitates easier layout design in various applications.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Integrated protections against transient spikes, overcurrent, and thermal issues enhance safety, reliability, and longevity of the device.

No. of Terminals: 20

With 20 terminals, this product offers numerous connectivity options, making it suitable for complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, making it advantageous for space-constrained designs.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage enables operation in a variety of low-power environments, enhancing application versatility.

Terminal Position: DUAL

Dual terminal position allows for easier routing and connectivity in PCB designs, providing better organization.

Maximum Seated Height: 2.65 mm

A low seated height supports slim design requirements and is suitable for applications where height is a concern.

Width: 7.5 mm

A compact width aids in optimizing layout and minimizes the overall size of the electronic assembly.

Length: 12.8 mm

The length is balanced for maintaining good performance characteristics while fitting into standard component footprints.

Technology: BCD

BCD technology provides efficient power control and enhances performance in driving applications.

Terminal Form: GULL WING

Gull wing terminals facilitate improved soldering and reliability of connections on PCBs.

Nominal Supply Voltage: 14 V

A nominal supply voltage of 14 V makes it ideal for a variety of applications requiring stable performance.

Turn-on Time: 3.5 us

Fast turn-on time enhances responsiveness in applications, making it suitable for high-speed operations.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compact design while maintaining adequate spacing for soldering.

Nominal Output Peak Current Limit: 0.7 A

The 0.7 A peak current limit is suitable for driving peripheral devices while maintaining safe operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface allows for efficient data handling and signal driving, making it versatile in application scenarios.

Turn-off Time: 4.5 us

The quick turn-off time enables efficient control and reduces power consumption, making it a favorable choice for dynamic applications.

Output Current Flow Direction: SINK

Sinking output current is beneficial for driving loads and facilitates simpler connection in common circuit configurations.

Technical Specifications

Peripheral Drivers L9338DTR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Width:

7.5 mm

Trade Compliance

L9338DTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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