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L9339-TR

STMicroelectronics

L9339-TR by STMicroelectronics

L9339-TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 32V and operates in extreme temps from -40 °C to 125°C. It features built-in transient and thermal protections, making it ideal for automotive applications. With a compact SO package and fast turn-on time of 3.5µs, it's perfect for efficient signal buffering or inversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,020 parts In-Stock

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5,020

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Chip Stock

USA . 2,700 parts In-Stock

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2,700

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Digiode

USA . 2,410 parts In-Stock

1+ parts

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2,410

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Anansix

USA . 1,888 parts In-Stock

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1,888

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,371 parts In-Stock

1+ parts

$1.580

100+ parts

-

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1,371

$1.580

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$9.970

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-

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873

$9.970

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IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$10.469

100+ parts

-

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$9.422

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552

$10.469

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$9.422

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Microchip USA

USA . 3,636 parts In-Stock

1+ parts

$11.798

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3,636

$11.798

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MKK Technologies

India . 949 parts In-Stock

1+ parts

$19.686

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949

$19.686

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DigiPath Technology Company

USA . 949 parts In-Stock

1+ parts

$19.686

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949

$19.686

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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Corphita

USA . 3,994 parts In-Stock

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3,994

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Parana Technologies

USA . 2,116 parts In-Stock

1+ parts

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$12.517

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2,116

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$12.517

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Overview

Unlock the power of reliability with the L9339-TR from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, this high-performance peripheral driver ensures optimal functionality in demanding environments. With robust built-in protections and a wide supply voltage range, you can trust its durability and efficiency. Elevate your projects with a product that combines quality, performance, and exceptional support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it reliable for various applications.

Surface Mount: YES

Designed for surface mounting, this product simplifies PCB assembly and is suitable for modern design layouts, enhancing production efficiency.

Maximum Supply Voltage: 32 V

With a maximum supply voltage of 32 V, this driver can operate in high-voltage environments, providing flexibility for diverse applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, accommodating compact design requirements.

Built-in Protections: TRANSIENT; THERMAL

Integrated transient and thermal protection mechanisms enhance the product's longevity and reliability under varied operational conditions.

Power Supplies (V): 4.5/32

The wide power supply range from 4.5 to 32 V makes this peripheral driver versatile for various electronic systems.

No. of Terminals: 20

Featuring 20 terminals, the product offers adequate connections for complex circuit designs, enhancing project compatibility.

Package Style (Meter): SMALL OUTLINE

A small outline package style allows for tight integration in space-constrained applications without sacrificing performance.

Minimum Supply Voltage: 4.5 V

Starting at a minimum of 4.5 V makes the driver suitable for low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 125 °C

Withstanding up to 125 °C, this driver is ideal for automotive and industrial applications where high temperatures may occur.

Minimum Operating Temperature: -40 °C

Operational at -40 °C ensures performance stability in extreme environmental conditions, broadening application scope.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish enhances solderability, facilitating easier assembly and improving overall connection reliability.

Terminal Position: DUAL

Dual-terminal positioning allows for versatile mounting options, accommodating different PCB layouts and designs.

Maximum Seated Height: 2.65 mm

With a maximum seated height of just 2.65 mm, this component is suitable for low-profile applications, conserving vertical space.

Width: 7.5 mm

A compact width of 7.5 mm aids in space-efficient designs, perfect for crowded circuit boards.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with various assembly processes while preventing damage to sensitive components.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures up to 260 °C helps in ensuring integration into high-performance manufacturing processes.

Length: 12.8 mm

A length of 12.8 mm contributes to the compactness of the product, making it suitable for various constrained spaces.

Temperature Grade: AUTOMOTIVE

Designed for automotive temperature grades, this driver ensures reliability and performance in demanding automotive applications.

Technology: BCDMOS

The BCDMOS technology enhances performance and power efficiency, making it well-suited for advanced electronic systems.

Terminal Form: GULL WING

Gull-wing terminal forms provide excellent mechanical stability and ease of soldering, facilitating reliable connections.

Turn-on Time: 3.5 us

A fast turn-on time of 3.5 microseconds enhances the responsiveness of the driver, essential for high-speed applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for denser packing on PCBs while maintaining adequate spacing for soldering.

Driver No. of Bits: 4

With 4 bits for driver control, this product offers suitable flexibility for handling various control schemes and interface requirements.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring that the product can be reliably stored and handled in typical conditions.

Nominal Output Peak Current Limit: 0.7 A

A peak current limit of 0.7 A enables the driver to handle substantial loads, ideal for driving peripheral devices effectively.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter-based interface enhances versatility, allowing this driver to be integrated into various control architectures.

Turn-off Time: 4.5 us

A turn-off time of 4.5 microseconds contributes to the overall efficiency and responsiveness, suitable for dynamic applications.

Output Current Flow Direction: SINK

A sink output current direction allows for straightforward integration into circuits where ground referencing is necessary.

Technical Specifications

Peripheral Drivers L9339-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

TTL AND CMOS COMPATIBLE INPUTS

Built-in Protections:

TRANSIENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Width:

7.5 mm

Trade Compliance

L9339-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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