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L9339MD-TR

STMicroelectronics

L9339MD-TR by STMicroelectronics

L9339MD-TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 32V, operating temp range from -40 °C to 125°C, and built-in transient/thermal protections. Ideal for automotive applications, it features a compact SO package with 20 terminals. This BCDMOS technology driver supports up to 0.7A output current, ensuring reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,370 parts In-Stock

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4,370

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Digiode

USA . 4,346 parts In-Stock

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4,346

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Anansix

USA . 1,641 parts In-Stock

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1,641

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,140 parts In-Stock

1+ parts

$2.437

100+ parts

-

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$2.193

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2,140

$2.437

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$2.193

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MKK Technologies

India . 2,324 parts In-Stock

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$4.583

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2,324

$4.583

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DigiPath Technology Company

USA . 2,324 parts In-Stock

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$4.583

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2,324

$4.583

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AZTECH Wire

Italy . 149 parts In-Stock

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$14.960

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149

$14.960

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QUARKTWIN TECHNOLOGY LTD

USA . 24,938 parts In-Stock

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24,938

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Vigor

Singapore . 9,835 parts In-Stock

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Microchip USA

USA . 4,383 parts In-Stock

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Corphita

USA . 2,889 parts In-Stock

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2,889

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Parana Technologies

USA . 1,196 parts In-Stock

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$2.914

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$2.914

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Perfect Parts

USA . 269 parts In-Stock

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269

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Overview

Elevate your designs with the L9339MD-TR from STMicroelectronics, a trusted leader in high-quality integrated circuits. This advanced peripheral driver ensures exceptional performance with built-in thermal and transient protections, making it ideal for automotive applications. With its compact outline and robust operating range, this versatile driver offers unmatched reliability and efficiency, empowering your projects to thrive in demanding environments while minimizing downtime.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it ideal for various applications.

Surface Mount: YES

Being surface mount technology (SMT) compatible allows for easy integration and compact designs in modern electronic circuits.

Maximum Supply Voltage: 32 V

A maximum supply voltage of 32 V enables compatibility with a wide range of power supplies, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on circuit boards, allowing for high-density designs.

Built-in Protections: TRANSIENT; THERMAL

Integrated transient and thermal protection enhances reliability and prolongs the device’s lifespan in varying operating conditions.

Power Supplies (V): 4.5/32

Supports a flexible power supply range from 4.5 V to 32 V, accommodating both low and high-power applications.

No. of Terminals: 20

With 20 terminals, it provides ample connection points for functionality, catering to complex circuit requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall PCB footprint, benefiting space-constrained applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows the device to operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 125 °C

An operating temperature range up to 125 °C makes it suitable for high-temperature environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures functionality in extreme cold, making it robust for outdoor and harsh conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finishes improve solderability and corrosion resistance, ensuring reliable connections in the long term.

Terminal Position: DUAL

Dual terminal positions enhance design flexibility, allowing for various PCB layout options.

Maximum Seated Height: 2.65 mm

A low seated height of 2.65 mm reduces the chances of interference with other components, suitable for compact layouts.

Width: 7.5 mm

The 7.5 mm width is compatible with various PCB designs, providing versatility in layout.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum peak reflow time of 30 seconds is optimal for ensuring stable solder joints without damaging the device.

Peak Reflow Temperature °C: 260

Operating at a peak reflow temperature of 260 °C allows for compatibility with modern soldering techniques.

Length: 12.8 mm

The compact length of 12.8 mm contributes to space efficiency on circuit boards, ideal for high-density designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring it meets stringent reliability and durability standards in vehicles.

Technology: BCDMOS

BCD technology combines analog and digital functions, offering high performance in a single-chip solution.

Terminal Form: GULL WING

Gull wing terminals facilitate simple mounting and soldering, ensuring reliable connections.

Turn-on Time: 3.5 us

Fast turn-on time of 3.5 microseconds enhances the responsiveness of the peripheral drivers in applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact designs and compatibility with standard PCB manufacturing processes.

Driver No. of Bits: 4

The 4-bit driver provides adequate control for middle-level applications, offering a balance between complexity and functionality.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a moderate sensitivity to moisture, providing guidelines for handling and storage to maintain performance.

Nominal Output Peak Current Limit: 0.7 A

The nominal output peak current limit of 0.7 A ensures adequate drive strength for various peripheral devices.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface IC type provides flexibility in design, suitable for a range of applications involving buffering and inversion.

Turn-off Time: 4.5 us

A quick turn-off time of 4.5 microseconds improves overall circuit efficiency by ensuring rapid state changes.

Output Current Flow Direction: SINK

The sinking output current flow direction is beneficial for grounding applications, enabling smooth control over peripheral devices.

Technical Specifications

Peripheral Drivers L9339MD-TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

TTL AND CMOS COMPATIBLE INPUTS

Built-in Protections:

TRANSIENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Width:

7.5 mm

Trade Compliance

L9339MD-TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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