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L9332

STMicroelectronics

L9332 by STMicroelectronics

L9332 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V, supporting up to 4 functions. It features built-in overcurrent and thermal protections, making it ideal for automotive and industrial applications. Its compact design includes 20 terminals in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,260 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,260

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-

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Anansix

USA . 2,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,140

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-

-

-

Digiode

USA . 1,218 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,218

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,840 parts In-Stock

1+ parts

$3.473

100+ parts

-

1k+ parts

$3.126

10k+ parts

-

1,840

$3.473

-

$3.126

-

MKK Technologies

India . 1,727 parts In-Stock

1+ parts

$6.531

100+ parts

-

1k+ parts

-

10k+ parts

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1,727

$6.531

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DigiPath Technology Company

USA . 1,727 parts In-Stock

1+ parts

$6.531

100+ parts

-

1k+ parts

-

10k+ parts

-

1,727

$6.531

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Corphita

USA . 2,833 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,833

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Parana Technologies

USA . 1,890 parts In-Stock

1+ parts

-

100+ parts

$4.152

1k+ parts

-

10k+ parts

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1,890

-

$4.152

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Overview

Elevate your projects with the L9332 from STMicroelectronics, a trusted leader in innovative solutions. This versatile peripheral driver excels in efficiency and reliability, featuring built-in protections against overcurrent and thermal issues, ensuring your designs stay safe and robust. Perfect for automotive applications, home automation, or industrial controls, the L9332 delivers exceptional performance while simplifying your design process, making it the ideal choice for engineers seeking quality and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures robust performance and longevity, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for more compact designs and easier integration into modern electronic circuits.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage, this driver can accommodate a wide range of applications, increasing its versatility.

No. of Functions: 4

This multi-functional capability enables the integration of various operations within a single component, saving board space and simplifying design.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient space utilization on PCBs, allowing for better layout options in designs.

Built-in Protections: OVER CURRENT; THERMAL

Safety features like over current and thermal protection enhance reliability and protection of the product during operation, reducing the risk of failure.

Power Supplies (V): 4.5/32

The ability to operate over a wide voltage range (4.5V to 32V) makes this peripheral driver suitable for a diverse range of applications.

No. of Terminals: 20

With 20 terminals available, this driver provides ample connectivity options for various configurations and designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with a heat sink slug allows efficient thermal management, making it suitable for high-performance applications.

Minimum Supply Voltage: 4.5 V

A low minimum supply voltage allows the driver to be used in low-power applications, enhancing energy efficiency.

Terminal Position: DUAL

Dual terminal positioning provides flexible routing options on the PCB, improving versatility in design layout.

Maximum Seated Height: 3.6 mm

The low seated height contributes to slim designs, making it ideal for compact electronic devices.

Width: 11 mm

A narrow width allows for efficient space use in tight PCB layouts, aiding in space-constrained applications.

Length: 15.9 mm

A well-proportioned length helps in optimizing the footprint on the PCB, contributing to overall device miniaturization.

Maximum Output Current: 0.015 A

Handles a moderate output current, making it suitable for driving various peripheral devices effectively.

Technology: BCDMOS

Advanced BCDMOS technology ensures high efficiency and performance characteristics designed for power management applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, ensuring reliable connections in high-vibration environments.

Nominal Supply Voltage: 8 V

The nominal supply voltage of 8V is optimal for many applications, providing a balance between performance and power efficiency.

Turn-on Time: 25 us

Fast turn-on time ensures quick response in dynamic applications, enhancing overall system performance.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compact layouts while still providing sufficient space for effective soldering.

Driver No. of Bits: 4

Four bits of driving capability enable precise control and interfacing with various peripherals, enhancing functionality.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This interface type supports a wide variety of applications, ensuring flexibility and compatibility in design.

Turn-off Time: 50 us

Quick turn-off time facilitates faster switching, which is critical in high-speed applications.

Output Current Flow Direction: SINK

Sink output current flow is ideal for many common applications, allowing for easier integration with various load types.

Technical Specifications

Peripheral Drivers L9332 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

.015 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

50 us

Turn-on Time:

25 us

Width:

11 mm

Trade Compliance

L9332 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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