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L9332-DIE1

STMicroelectronics

L9332-DIE1 by STMicroelectronics

L9332-DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and built-in protections against overcurrent and thermal issues. It features four functions, operates b/w 4.5V to 32V, and has fast turn-on/off times of 25µs and 50µs. Ideal for buffer or inverter applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,963 parts In-Stock

1+ parts

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2,963

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Digiode

USA . 1,870 parts In-Stock

1+ parts

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1k+ parts

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1,870

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Anansix

USA . 1,231 parts In-Stock

1+ parts

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1,231

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 863 parts In-Stock

1+ parts

$12.127

100+ parts

-

1k+ parts

$10.914

10k+ parts

-

863

$12.127

-

$10.914

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MKK Technologies

India . 1,156 parts In-Stock

1+ parts

$22.803

100+ parts

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10k+ parts

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1,156

$22.803

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DigiPath Technology Company

USA . 1,156 parts In-Stock

1+ parts

$22.803

100+ parts

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10k+ parts

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1,156

$22.803

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Parana Technologies

USA . 1,669 parts In-Stock

1+ parts

-

100+ parts

$14.499

1k+ parts

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1,669

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$14.499

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Corphita

USA . 749 parts In-Stock

1+ parts

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749

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Overview

Elevate your designs with the L9332-DIE1 by STMicroelectronics, a standout in peripheral drivers renowned for its reliability and efficiency. Engineered for versatility, it effortlessly integrates into various applications, from automotive to industrial systems. With built-in protections against overcurrent and thermal issues, this chip ensures long-lasting performance. Trust in STMicroelectronics’ legacy of quality to deliver exceptional value and peace of mind for your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic circuits, saving space and reducing assembly costs.

Maximum Supply Voltage: 32 V

With a maximum supply voltage of 32 V, this peripheral driver can handle a wide range of applications, making it versatile for different use cases.

No. of Functions: 4

Having four functions provides flexibility in design, allowing developers to optimize circuits without the need for multiple components.

Built-in Protections: OVER CURRENT; THERMAL

The integrated over current and thermal protections enhance reliability and safety, reducing the risk of damage and increasing the lifespan of the device.

Package Style (Meter): UNCASED CHIP

The unformed chip package style facilitates bonding and is suitable for applications where board space is limited or for custom packaging solutions.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V allows operation in low-voltage applications, making it suitable for battery-powered devices.

Terminal Position: UPPER

The upper terminal position simplifies layout design for printed circuit boards, facilitating easier integration into various designs.

Terminal Form: NO LEAD

The no-lead terminal form reduces the overall footprint and can contribute to improved electrical performance, making it ideal for high-density applications.

Nominal Supply Voltage: 8 V

The nominal supply voltage of 8 V is optimal for many common applications, enabling support for various electronic component configurations.

Turn-on Time: 25 us

Fast turn-on time of 25 microseconds allows for quicker response in dynamic applications, enhancing overall system performance.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Being a buffer or inverter-based driver provides compatibility with a wide range of digital signals, making this IC flexible and easy to integrate.

Turn-off Time: 50 us

A turn-off time of 50 microseconds supports rapid signal modulation, making it suitable for applications requiring quick signal decay.

Output Current Flow Direction: SINK

The sink output current flow direction allows for simple interfacing with various loads, broadening its applications in electronic designs.

Technical Specifications

Peripheral Drivers L9332-DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

X-XUUC-N

No. of Functions:

4

Output Current Flow Direction:

SINK

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

8 V

Surface Mount:

YES

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

50 us

Turn-on Time:

25 us

Trade Compliance

L9332-DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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