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L9333DIE1

STMicroelectronics

L9333DIE1 by STMicroelectronics

L9333DIE1 by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 32V and built-in protections against transients, overcurrent, and thermal issues. It features a fast turn-on time of 3.5µs and supports output currents up to 15mA. Ideal for buffer or inverter applications, this chip ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,729 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,729

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-

-

-

Vyrian

USA . 1,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,220

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-

-

-

Digiode

USA . 271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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271

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,999 parts In-Stock

1+ parts

$8.874

100+ parts

-

1k+ parts

$7.987

10k+ parts

-

1,999

$8.874

-

$7.987

-

MKK Technologies

India . 763 parts In-Stock

1+ parts

$16.688

100+ parts

-

1k+ parts

-

10k+ parts

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763

$16.688

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-

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DigiPath Technology Company

USA . 763 parts In-Stock

1+ parts

$16.688

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$16.688

-

-

-

Parana Technologies

USA . 981 parts In-Stock

1+ parts

-

100+ parts

$10.611

1k+ parts

-

10k+ parts

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981

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$10.611

-

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Corphita

USA . 814 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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814

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Overview

Unlock unparalleled performance with the L9333DIE1 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficiency and reliability, this peripheral driver excels in demanding applications, thanks to built-in protections against transient, overcurrent, and thermal risks. With its compact, surface-mount design, it ensures seamless integration into your projects, delivering enhanced value and peace of mind for engineers and manufacturers alike. Elevate your designs with ST's trusted quality!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and easy integration into modern electronic circuits, making it ideal for space-constrained applications.

Maximum Supply Voltage: 32 V

The high maximum supply voltage makes this product versatile, accommodating a wide range of applications and ensuring reliability under various operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape contributes to a standardized footprint, enhancing compatibility with existing PCB layouts and facilitating the manufacturing process.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

Integrated protection features provide enhanced reliability and safety, preventing damage from unexpected electrical surges, overheating, and overcurrent situations.

No. of Terminals: 14

With 14 terminals, this device offers sufficient connectivity for complex functions, allowing for versatile circuit designs and reducing the need for additional components.

Package Style (Meter): UNCASED CHIP

The uncashed chip style is designed for efficient heat dissipation and lower weight, making it suitable for high-performance applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage permits operation in battery-powered devices, enhancing usability in portable applications.

Terminal Position: UPPER

Upper terminal positioning allows for easier access during PCB assembly and testing, simplifying the manufacturing process.

Technology: BCD

BCD technology combines analog and digital functions in a compact form, providing efficient power management and improved performance in peripheral driver applications.

Terminal Form: NO LEAD

No lead terminals contribute to a smaller footprint and reduced environmental impact, ensuring easier surface mounting and compliance with modern manufacturing standards.

Turn-on Time: 3.5 us

The quick turn-on time enhances responsiveness in applications where timing is critical, making it ideal for fast-changing signal environments.

Nominal Output Peak Current Limit: 0.015 A

A nominal output peak current limit of 0.015 A ensures reliable performance while preventing damage to connected components from excessive current.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This product's capability as a buffer or inverter based driver provides flexibility in interfacing with various logic levels, enhancing compatibility across different circuits.

Turn-off Time: 4.5 us

The efficient turn-off time reduces power wastage and enhances control in digital circuits, making it suitable for applications requiring fast switching.

Output Current Flow Direction: SINK

The sink output current flow direction makes it advantageous for driving loads that require active grounding, thus facilitating effective control and driving capability.

Technical Specifications

Peripheral Drivers L9333DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

JESD-30 Code:

R-XUUC-N14

No. of Functions:

1

No. of Terminals:

14

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.015 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

BCD

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Trade Compliance

L9333DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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