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L9338D

STMicroelectronics

L9338D by STMicroelectronics

L9338D by STMicroelectronics is a peripheral driver with 4 functions, max supply voltage of 32V, and built-in protections. It is used in applications requiring a small outline package style, such as buffer or inverter-based interface ICs for controlling external devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,065 parts In-Stock

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8,065

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Digiode

USA . 1,973 parts In-Stock

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1,973

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Anansix

USA . 630 parts In-Stock

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630

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ComSIT Distribution GmbH

Germany . 550 parts In-Stock

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$4.339

100+ parts

-

1k+ parts

$3.905

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-

2,121

$4.339

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$3.905

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MKK Technologies

India . 655 parts In-Stock

1+ parts

$8.159

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655

$8.159

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DigiPath Technology Company

USA . 655 parts In-Stock

1+ parts

$8.159

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655

$8.159

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Microchip USA

USA . 356 parts In-Stock

1+ parts

$9.436

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356

$9.436

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AZTECH Wire

Italy . 99 parts In-Stock

1+ parts

$18.200

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99

$18.200

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Component Stockers USA

USA . 310 parts In-Stock

1+ parts

$99.990

100+ parts

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310

$99.990

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A-Z Elektronik GmbH

Germany . 6,089 parts In-Stock

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6,089

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Alle Elektronik GmbH

Germany . 4,059 parts In-Stock

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4,059

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Kepictronics

USA . 2,050 parts In-Stock

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Corphita

USA . 1,731 parts In-Stock

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1,731

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Vigor

Singapore . 1,638 parts In-Stock

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1,638

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Parana Technologies

USA . 1,563 parts In-Stock

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$5.188

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1,563

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$5.188

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Overview

Enhance your electronic designs with the high-quality L9338D Peripheral Driver by STMicroelectronics. From its durable plastic/epoxy body to its built-in protections against transients, over current, and thermal issues, this product offers top-notch reliability for a wide range of applications. With a maximum supply voltage of 32V and a nominal output peak current limit of 0.7A, the L9338D ensures smooth operation and efficient performance. Trust in STMicroelectronics' expertise in semiconductor manufacturing and unlock the potential of your projects with the versatile L9338D Peripheral Driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package of this product durable and resistant to damage, ensuring long-term reliability.

Surface Mount: YES

The surface mount design allows for easy and convenient installation in various electronic devices.

Maximum Supply Voltage: 32 V

With a high maximum supply voltage, this peripheral driver can be used in a wide range of applications without the risk of voltage overload.

No. of Functions: 4

Having multiple functions in one device offers versatility and saves space in the circuit design.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL

The built-in protections ensure the safety and reliability of the connected components by preventing damage from transient events, over-current conditions, and high temperatures.

Power Supplies (V): 4.5/32

Supporting a wide range of power supply voltages, this driver can be used in various applications with different power requirements.

Maximum Output Current: 0.3 A

The maximum output current of 0.3 A allows for driving a moderate load, suitable for many peripheral devices.

Turn-on Time: 3.5 us

With a fast turn-on time of 3.5 microseconds, this driver can quickly respond to input signals, ensuring prompt operation.

Technical Specifications

Peripheral Drivers L9338D attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

14 V

Surface Mount:

YES

Technology:

BCD

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Width:

7.5 mm

Trade Compliance

L9338D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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