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L9339DIE1

STMicroelectronics

L9339DIE1 by STMicroelectronics

L9339DIE1 by STMicroelectronics is a robust peripheral driver designed for automotive applications, operating b/w 4.5V and 32V. It features built-in transient and thermal protections, with a max temp of 125 °C and output peak current limit of 0.7A. Its fast turn-on (3.5µs) and turn-off (4.5µs) times enhance performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,598 parts In-Stock

1+ parts

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10k+ parts

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3,598

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Digiode

USA . 2,970 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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2,970

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Anansix

USA . 248 parts In-Stock

1+ parts

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100+ parts

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248

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$12.669

100+ parts

-

1k+ parts

$11.402

10k+ parts

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1,720

$12.669

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$11.402

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MKK Technologies

India . 1,709 parts In-Stock

1+ parts

$23.824

100+ parts

-

1k+ parts

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10k+ parts

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1,709

$23.824

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DigiPath Technology Company

USA . 1,709 parts In-Stock

1+ parts

$23.824

100+ parts

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1k+ parts

-

10k+ parts

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1,709

$23.824

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Corphita

USA . 3,125 parts In-Stock

1+ parts

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3,125

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Parana Technologies

USA . 1,862 parts In-Stock

1+ parts

-

100+ parts

$15.148

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-

10k+ parts

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1,862

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$15.148

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Overview

Elevate your automotive designs with the L9339DIE1 from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. This robust peripheral driver ensures reliable performance across varied conditions, thanks to its superior thermal and transient protections. With easy integration and exceptional efficiency, it’s designed for both innovation and durability, making it ideal for automotive applications where resilience matters. Unlock excellence and dependability in your projects with this stellar component!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic systems and enhances manufacturing efficiency.

Maximum Supply Voltage: 32 V

A maximum supply voltage of 32 V broadens the application range, making it suitable for various automotive and industrial use cases.

Built-in Protections: TRANSIENT; THERMAL

Integrated transient and thermal protections increase reliability and prevent damage under harsh operating conditions, ensuring longevity.

Package Style (Meter): UNCASED CHIP

The uncaset chip package enables space-saving designs and flexibility in PCB layout, allowing for simpler product designs.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, it can operate efficiently in low-power applications, ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures (up to 125 °C) makes this driver suitable for high-performance automotive applications.

Minimum Operating Temperature: -40 °C

It functions effectively in extreme cold (-40 °C), ensuring reliable performance in harsh weather conditions.

Terminal Position: UPPER

The upper terminal position allows for ease of access and simplifies mounting on PCBs.

Temperature Grade: AUTOMOTIVE

Designed specifically to meet automotive standards, providing assurance of reliability and safety in automotive applications.

Terminal Form: NO LEAD

The lead-free terminal form contributes to environmental safety standards, making it compliant with RoHS regulations.

Turn-on Time: 3.5 µs

A rapid turn-on time allows for quick response in applications, enhancing overall system performance.

Nominal Output Peak Current Limit: 0.7 A

The nominal output peak current limit of 0.7 A supports a variety of peripheral devices, providing sufficient power without overstressing components.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Its buffer or inverter interface capabilities make it versatile for a wide range of peripheral driving applications.

Turn-off Time: 4.5 µs

Quick turn-off time enhances performance in switch mode applications, preventing unnecessary power dissipation.

Output Current Flow Direction: SINK

The sink current flow direction is ideal for controlling ground-referenced loads, improving flexibility in circuit design.

Technical Specifications

Peripheral Drivers L9339DIE1 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

TTL AND CMOS COMPATIBLE INPUTS

Built-in Protections:

TRANSIENT; THERMAL

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Trade Compliance

L9339DIE1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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