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L9339

STMicroelectronics

L9339 by STMicroelectronics

L9339 by STMicroelectronics is a robust peripheral driver with a max supply voltage of 32V and operates in extreme temps from -40 °C to 125°C. It features built-in transient and thermal protections, making it ideal for automotive applications. With a compact SO package, it supports efficient power management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,304 parts In-Stock

1+ parts

-

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7,304

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Digiode

USA . 4,106 parts In-Stock

1+ parts

-

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4,106

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Chip Stock

USA . 2,833 parts In-Stock

1+ parts

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2,833

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Anansix

USA . 926 parts In-Stock

1+ parts

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,114 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

-

10k+ parts

-

3,114

$1.580

-

-

-

IDEA Electronic Components Group

UK . 24 parts In-Stock

1+ parts

$8.468

100+ parts

-

1k+ parts

$7.621

10k+ parts

-

24

$8.468

-

$7.621

-

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$9.820

100+ parts

-

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-

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-

747

$9.820

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Microchip USA

USA . 2,195 parts In-Stock

1+ parts

$11.798

100+ parts

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2,195

$11.798

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-

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MKK Technologies

India . 105 parts In-Stock

1+ parts

$15.923

100+ parts

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105

$15.923

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DigiPath Technology Company

USA . 105 parts In-Stock

1+ parts

$15.923

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105

$15.923

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-

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Corphita

USA . 2,968 parts In-Stock

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2,968

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Perfect Parts

USA . 1,669 parts In-Stock

1+ parts

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1,669

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Parana Technologies

USA . 11 parts In-Stock

1+ parts

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100+ parts

$10.124

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11

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$10.124

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Overview

Unlock unparalleled performance with the L9339 from STMicroelectronics, a leading name in innovation and quality. Designed for automotive applications, this robust peripheral driver delivers exceptional reliability with built-in protections against transients and thermal issues. Experience seamless integration in your designs, ensuring optimal efficiency and longevity. Trust STMicroelectronics to elevate your projects with cutting-edge technology that empowers your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material ensures the longevity of the peripheral driver under various conditions.

Surface Mount: YES

Surface mount technology allows for efficient usage of board space and easier integration in modern electronics.

Maximum Supply Voltage: 32 V

High voltage tolerance enhances the chip's versatility for different applications, improving system design flexibility.

Package Shape: RECTANGULAR

Rectangular package shape optimizes PCB layout and provides efficient space utilization.

Built-in Protections: TRANSIENT; THERMAL

Integrated protection features safeguard against sudden voltage spikes and overheating, ensuring reliable operation.

Power Supplies (V): 4.5/32

Wide voltage supply range accommodates various system requirements, making it compatible with different designs.

No. of Terminals: 20

A sufficient number of terminals allows for multiple connections, enhancing functionality and complexity in applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style minimizes space requirements on printed circuit boards, ideal for compact designs.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage enables operation in low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range makes this driver suitable for automotive and industrial applications where heat dissipation is crucial.

Minimum Operating Temperature: -40 °C

Extended low temperature range allows for reliable operation in extreme conditions, ideal for automotive environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Quality terminal finish ensures excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal position design facilitates easier routing on the PCB and optimal signal integrity.

Maximum Seated Height: 2.65 mm

Low profile height increases design flexibility and allows for thinner devices.

Width: 7.5 mm

Compact width supports space-saving designs while maintaining functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Allows sufficient time for soldering during assembly without damaging the component.

Peak Reflow Temperature °C: 260

Capability to withstand high reflow temperatures safeguards the integrity during manufacturing processes.

Length: 12.8 mm

Appropriate length allows easy integration into diverse electronic applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade qualification ensures reliability and performance in demanding environments.

Technology: BCDMOS

BCD (Bipolar-CMOS-DMOS) technology combines high-voltage, high-current capabilities with low power consumption.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and facilitate automated assembly.

Turn-on Time: 3.5 us

Fast turn-on time enhances performance and responsiveness in peripheral driving applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows compatibility with various PCB designs and assembly processes.

Driver No. of Bits: 4

Four-bit driver capability makes it suitable for diverse digital applications, increasing its utility.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level ensures understanding of storage and handling requirements during assembly.

Nominal Output Peak Current Limit: 0.7 A

Adequate current limit supports a variety of connected devices and compatible load requirements.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface type allows integration into various signal processing applications, increasing adaptability.

Turn-off Time: 4.5 us

Quick turn-off time contributes to the overall efficiency and performance of driving circuits.

Output Current Flow Direction: SINK

Sink current capability is frequently required in peripheral devices, ensuring compatibility with common system designs.

Technical Specifications

Peripheral Drivers L9339 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Additional Features:

TTL AND CMOS COMPATIBLE INPUTS

Built-in Protections:

TRANSIENT; THERMAL

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/32

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

32 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

4.5 us

Turn-on Time:

3.5 us

Width:

7.5 mm

Trade Compliance

L9339 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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