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HCF4042BEY

STMicroelectronics

HCF4042BEY by STMicroelectronics

HCF4042BEY by STMicroelectronics is a 4-bit latch with 360 ns propagation delay at 5V. It has a temperature range of -55 to 125 °C and operates on supply voltages from 3V to 20V. Ideal for military-grade applications requiring high-level trigger latches in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,366 parts In-Stock

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Magnum Semiconductors LLP

India . 6,200 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,225 parts In-Stock

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Anansix

USA . 2,132 parts In-Stock

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Digiode

USA . 1,949 parts In-Stock

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LWI Electronics Inc

India . 1,000 parts In-Stock

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ECAB

Sweden . 715 parts In-Stock

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R&J Components

USA . 482 parts In-Stock

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Resion

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AZTECH Wire

Italy . 523 parts In-Stock

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$22.010

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523

$22.010

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Ampacity Inc.

Singapore . 730 parts In-Stock

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$26.000

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730

$26.000

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

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$29.623

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$26.661

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2,039

$29.623

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$26.661

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MKK Technologies

India . 792 parts In-Stock

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$55.704

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DigiPath Technology Company

USA . 792 parts In-Stock

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$55.704

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Native Components

USA . 283 parts In-Stock

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$145.460

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$139.641

283

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$139.641

Northwest PG Solutions

USA . 567 parts In-Stock

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$160.006

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$160.006

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Infinite Electronics LLP (Excess)

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QUARKTWIN TECHNOLOGY LTD

USA . 13,504 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,742 parts In-Stock

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Corphita

USA . 4,349 parts In-Stock

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Perfect Parts

USA . 2,856 parts In-Stock

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Assy Fe

Spain . 2,500 parts In-Stock

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Parana Technologies

USA . 1,368 parts In-Stock

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$35.419

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$35.419

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Overview

Unlock endless possibilities with the HCF4042BEY from STMicroelectronics, a leading manufacturer known for top-quality electronic components. As part of the Latches & Flip-Flops category, this product offers reliable performance and precise functionality for a wide range of applications. With a focus on durability and efficiency, this versatile component is designed to enhance your projects while providing value-driven benefits to customers. Experience innovation at its finest with the HCF4042BEY from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a durable and lightweight housing for the latch or flip-flop, making it suitable for various applications.

Propagation Delay At Nominal Supply: 360 ns

With a low propagation delay at the nominal supply voltage, this latch or flip-flop can quickly respond to input changes, ensuring efficient performance.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common nominal supply voltage of 5V makes this latch or flip-flop compatible with standard electronic systems and easy to integrate.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF ensures that the latch or flip-flop can drive or control external circuits effectively without causing signal degradation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this latch or flip-flop can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Trigger Type: HIGH LEVEL

The high-level trigger type ensures that the latch or flip-flop responds to a specific voltage level, providing reliable and controlled operation in digital circuits.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in various electronic systems.

Technical Specifications

Latches & Flip-Flops HCF4042BEY attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Additional Features:

PROGRAMMABLE TRIGGER TYPE

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

360 ns

Propagation Delay (tpd):

500 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

7.62 mm

Trade Compliance

HCF4042BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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