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ACST4-7SB

STMicroelectronics

ACST4-7SB by STMicroelectronics

ACST4-7SB by STMicroelectronics is a single TRIAC designed for efficient AC control. It features a max RMS on-state current of 4A, repetitive peak off-state voltage of 700V, and operates b/w -30 °C to 125 °C. Ideal for applications requiring compact surface mount solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,528 parts In-Stock

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3,528

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Anansix

USA . 2,519 parts In-Stock

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2,519

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Digiode

USA . 274 parts In-Stock

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274

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Corel Iberica Componentes, S.L.

Spain . 50 parts In-Stock

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ComSIT Distribution GmbH

Germany . 31 parts In-Stock

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ComSIT USA

USA . 31 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 437 parts In-Stock

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$1.742

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437

$1.742

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Northwest PG Solutions

USA . 764 parts In-Stock

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$1.916

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764

$1.916

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IDEA Electronic Components Group

UK . 295 parts In-Stock

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$4.006

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$3.605

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295

$4.006

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$3.605

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MKK Technologies

India . 573 parts In-Stock

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$7.532

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573

$7.532

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DigiPath Technology Company

USA . 573 parts In-Stock

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$7.532

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AZTECH Wire

Italy . 1,012 parts In-Stock

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$13.290

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$13.290

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Ampacity Inc.

Singapore . 799 parts In-Stock

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$30.100

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Component Stockers USA

USA . 468 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 3,018 parts In-Stock

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Parana Technologies

USA . 1,691 parts In-Stock

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$4.789

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Assy Fe

Spain . 50 parts In-Stock

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Overview

Unlock the full potential of your projects with the ACST4-7SB from STMicroelectronics, a trusted leader in innovative solutions. This high-performance TRIAC delivers exceptional reliability and efficiency, perfect for controlling AC loads across various applications like home automation and motor control. With its robust design and compact surface mount package, it ensures seamless integration and superior thermal management, providing unmatched value and peace of mind for engineers and developers alike.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides excellent insulation, making this TRIAC suitable for various applications.

Maximum DC Gate Trigger Current: 10 mA

A low trigger current allows for easy integration with microcontrollers and other logic devices, enhancing circuit efficiency.

Configuration: SINGLE

Single configuration simplifies design and reduces complexity, making it easier for developers to incorporate into circuits.

Surface Mount: YES

Surface mount packaging enables high-density mounting on PCBs, ideal for modern compact electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on a circuit board, facilitating better layout options.

Terminal Form: GULL WING

Gull wing terminals provide superior soldering reliability and ease of assembly in automated processes.

Maximum Leakage Current: 0.5 mA

A low maximum leakage current results in improved energy efficiency and less heat generation during operation.

No. of Terminals: 2

Having only two terminals simplifies connections and minimizes potential error points in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package saves board space and allows for high-density component placement.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows this TRIAC to perform reliably in challenging environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

This type ensures effective and efficient control over AC loads and facilitates greater versatility in application.

Minimum Operating Temperature: -30 °C

The wide temperature range allows reliable operation in extreme conditions, increasing application possibilities.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, enhancing the longevity of the product.

Terminal Position: SINGLE

Single terminal position minimizes board real estate usage and simplifies circuit design.

Maximum RMS On-state Current: 4 A

This high on-state current rating supports robust performance in power-controlled applications.

Maximum DC Gate Trigger Voltage: 1 V

A low gate trigger voltage ensures compatibility with low-voltage control circuits, enhancing flexibility.

Case Connection: MAIN TERMINAL 1

Simplified case connectivity promotes easier assembly and better efficiency in manufacturing processes.

Repetitive Peak Off-state Voltage: 700 V

A high off-state voltage rating enables use in high-voltage applications, ensuring safety and reliability.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/μs

A high rate of rise allows for effective switching in fast transient conditions, enhancing overall performance.

Maximum Holding Current: 20 mA

Low holding current helps in maintaining stable performance while also contributing to power savings.

Technical Specifications

Triode For Alternating Current (TRIAC) ACST4-7SB attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

10 mA

Maximum DC Gate Trigger Voltage:

1 V

Maximum Holding Current:

20 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

.5 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

ACST4-7SB Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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