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A1P25S12M3-F

STMicroelectronics

A1P25S12M3-F by STMicroelectronics

A1P25S12M3-F by STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max VCEsat of 2.45V, 197W power dissipation, and operates b/w -40 °C to 150 °C. Ideal for high-efficiency switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,574 parts In-Stock

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Digiode

USA . 3,515 parts In-Stock

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Anansix

USA . 972 parts In-Stock

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Native Components

USA . 863 parts In-Stock

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$0.964

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863

$0.964

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Northwest PG Solutions

USA . 1,404 parts In-Stock

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$1.061

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1,404

$1.061

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IDEA Electronic Components Group

UK . 643 parts In-Stock

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$1.067

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$0.960

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643

$1.067

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MKK Technologies

India . 1,319 parts In-Stock

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$2.007

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$2.007

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DigiPath Technology Company

USA . 1,319 parts In-Stock

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$2.007

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$2.007

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AZTECH Wire

Italy . 525 parts In-Stock

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$9.610

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$9.610

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Microchip USA

USA . 9,100 parts In-Stock

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$115.644

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$115.644

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QUARKTWIN TECHNOLOGY LTD

USA . 20,876 parts In-Stock

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Corphita

USA . 2,091 parts In-Stock

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Parana Technologies

USA . 1,427 parts In-Stock

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$1.276

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Perfect Parts

USA . 121 parts In-Stock

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Overview

Unlock the potential of your power control designs with the A1P25S12M3-F from STMicroelectronics. Renowned for its exceptional quality and reliability, STMicroelectronics delivers this advanced N-Channel IGBT, engineered for efficiency and robust performance. With a wide temperature range and impressive power dissipation capabilities, this versatile device excels in diverse applications, ensuring your projects achieve optimal results and longevity. Elevate your innovation with trusted technology that enhances productivity and performance!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs are preferred for their efficient operation and better performance in power control applications, making this product ideal for high-power scenarios.

Configuration: COMPLEX

The complex configuration enables versatility in various applications, enhancing the device's functionality in power management systems.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is excellent for applications requiring precise voltage regulation and energy efficiency.

Maximum VCEsat: 2.45 V

A low VCEsat minimizes conduction losses, improving efficiency and thermal performance during operation.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient thermal dissipation and compact design integration into various systems.

No. of Elements: 6

Having six elements enhances the power handling capability, making this IGBT suitable for high-density power applications.

Nominal Turn Off Time (toff): 326 ns

A relatively quick turn-off time reduces switching losses and improves overall circuit efficiency, beneficial in fast-switching applications.

No. of Terminals: 22

The 22 terminals provide multiple connection options for flexible circuit designs, facilitating easier integration into complex systems.

Maximum Power Dissipation (Abs): 197 W

Capable of dissipating up to 197 W, this IGBT can handle significant power load, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

The flange mount design ensures secure installation and efficient heat management, crucial for high-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this IGBT is reliable under extreme conditions, increasing system durability.

Maximum Collector-Emitter Voltage: 1200 V

A high collector-emitter voltage rating allows this IGBT to be used safely in high-voltage applications, providing both safety and efficiency.

Transistor Element Material: SILICON

Silicon is a standard in semiconductor technology, offering good thermal stability and performance for reliable operation.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V supports reliable control without damaging the transistor, ensuring stable operation.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C ensures that this IGBT can function in a wide range of environmental conditions.

Maximum Collector Current (IC): 25 A

Handling a maximum collector current of 25 A makes this IGBT suitable for high-current applications while maintaining efficiency.

Maximum Gate-Emitter Threshold Voltage: 7 V

A low threshold voltage enhances the device's performance in digital circuits, allowing faster switching and better control.

Terminal Position: UPPER

Upper terminal positioning may facilitate easier layout design and improved thermal management in printed circuit boards.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unintended circuit connections and reducing noise interference.

Nominal Turn On Time (ton): 139 ns

A quick turn-on time of 139 ns enables rapid switching applications, making this product ideal for high-speed power management.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) A1P25S12M3-F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X22

No. of Elements:

6

No. of Terminals:

22

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

326 ns

Nominal Turn On Time (ton):

139 ns

Maximum VCEsat:

2.45 V

Trade Compliance

A1P25S12M3-F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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