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74V1T86CTR

STMicroelectronics

74V1T86CTR by STMicroelectronics

74V1T86CTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9.5 ns and operates at a nominal voltage of 5V. It features dual inputs and is ideal for compact, high-speed applications in military environments. Its small outline package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,938 parts In-Stock

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Vyrian

USA . 2,632 parts In-Stock

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2,632

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Anansix

USA . 1,897 parts In-Stock

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1,897

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Distributors (Availability)

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Native Components

USA . 760 parts In-Stock

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$0.379

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-

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$0.364

760

$0.379

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$0.364

Northwest PG Solutions

USA . 1,063 parts In-Stock

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$0.417

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$0.368

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$0.417

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$0.368

Microchip USA

USA . 421 parts In-Stock

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$9.276

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421

$9.276

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IDEA Electronic Components Group

UK . 413 parts In-Stock

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$12.118

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$10.906

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413

$12.118

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$10.906

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AZTECH Wire

Italy . 511 parts In-Stock

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$19.150

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511

$19.150

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MKK Technologies

India . 2,234 parts In-Stock

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$22.788

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$22.788

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$22.788

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$22.788

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A-Z Elektronik GmbH

Germany . 5,483 parts In-Stock

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Corphita

USA . 1,258 parts In-Stock

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Parana Technologies

USA . 814 parts In-Stock

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$14.489

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Overview

Elevate your designs with the 74V1T86CTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality logic gate delivers fast performance and exceptional reliability, ensuring optimal efficiency in various applications ranging from automotive to industrial controls. With its compact size and robust temperature range, this product empowers you to create cutting-edge electronics that stand out in today’s competitive market, maximizing value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and protection against environmental factors, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 9.5 ns

A low propagation delay enhances the speed of signal processing, making this logic gate suitable for high-performance applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronic devices.

No. of Inputs: 2

Having two inputs enables versatile logic operations, providing flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the circuit board and facilitates easier integration into various designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

This capacitance value ensures efficient signal integrity and reduced power consumption during operation.

Power Supplies (V): 5

Supports a stable power supply of 5V, simplifying design considerations in power management.

No. of Terminals: 5

A five-terminal design provides necessary connectivity while maintaining a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for space-constrained applications, enhancing design possibilities.

Maximum I (ol): 8 Amp

High current output capability of 8A allows the gate to interface directly with power components, improving versatility in circuit applications.

Propagation Delay (tpd): 9.5 ns

Consistent propagation delay corroborates high-speed performance, favorable for time-critical applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can function well in extreme conditions, making it suitable for a range of environments.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures ensures reliability in colder climates and environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish offers excellent solderability and corrosion resistance, extending the product's lifespan.

Terminal Position: DUAL

Dual terminal position allows for more versatile PCB layout options and better integration into different designs.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slim device profile, essential for modern compact electronics.

Width: 1.25 mm

Narrow width permits denser circuit board designs, which is crucial in high-performance applications.

Minimum Supply Voltage (Vsup): 4.5 V

It can operate effectively with a minimum supply voltage of 4.5V, allowing flexibility in power supply design.

Maximum Time At Peak Reflow Temperature (s): 30

A limit on the reflow exposure time ensures robustness during manufacturing, minimizing the risk of damage to sensitive components.

Peak Reflow Temperature °C: 260

Support for high peak reflow temperatures indicates compatibility with lead-free soldering processes, aligning with modern manufacturing standards.

Length: 2 mm

The compact length facilitates easy placement in tight spaces on PCBs, enhancing design flexibility.

Temperature Grade: MILITARY

Certified for military-grade use, ensuring reliability in challenging environments and applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, vital for efficient logic circuit operation.

Terminal Form: GULL WING

The gull wing terminal form offers excellent soldering characteristics, leading to reliable connections and reduced assembly costs.

Packing Method: TR

Tape and reel packing method facilitates efficient handling and storage during assembly, improving manufacturing productivity.

Terminal Pitch: 0.65 mm

A standard terminal pitch of 0.65mm enables compatibility with a wide range of PCB designs, simplifying integration.

Maximum Supply Voltage (Vsup): 5.5 V

Ability to tolerate up to 5.5V supply voltage allows for some flexibility in power management without risking damage.

Technical Specifications

Logic Gates 74V1T86CTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

74V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

74V1T86CTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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