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5962-8606305YX

STMicroelectronics

5962-8606305YX by STMicroelectronics

5962-8606305YX by STMicroelectronics is a military-grade EPROM with a 32K x 8 organization, operating asynchronously at a nominal voltage of 5V. It features a ceramic, metal-sealed package and operates b/w -55 °C to 125 °C. Ideal for high-reliability applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

5962-8606305YX by STMicroelectronics
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Digiode

USA . 4,994 parts In-Stock

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4,994

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Anansix

USA . 2,328 parts In-Stock

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2,328

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Vyrian

USA . 250 parts In-Stock

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250

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

1+ parts

$2.422

100+ parts

-

1k+ parts

$2.180

10k+ parts

-

2,078

$2.422

-

$2.180

-

MARBEL Systems

Belgium . 300 parts In-Stock

1+ parts

$2.654

100+ parts

-

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-

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300

$2.654

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Texas Native Microelectronics

USA . 200 parts In-Stock

1+ parts

$3.051

100+ parts

$2.929

1k+ parts

$2.837

10k+ parts

$2.685

200

$3.051

$2.929

$2.837

$2.685

Kenton Components

USA . 69 parts In-Stock

1+ parts

$3.661

100+ parts

-

1k+ parts

-

10k+ parts

$3.222

69

$3.661

-

-

$3.222

MKK Technologies

India . 1,589 parts In-Stock

1+ parts

$4.555

100+ parts

-

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1,589

$4.555

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DigiPath Technology Company

USA . 1,589 parts In-Stock

1+ parts

$4.555

100+ parts

-

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1,589

$4.555

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-

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Qasali Group International

UK . 40 parts In-Stock

1+ parts

$8.238

100+ parts

-

1k+ parts

$7.661

10k+ parts

$7.249

40

$8.238

-

$7.661

$7.249

Native Components

USA . 863 parts In-Stock

1+ parts

$46.530

100+ parts

-

1k+ parts

-

10k+ parts

$44.669

863

$46.530

-

-

$44.669

Northwest PG Solutions

USA . 1,091 parts In-Stock

1+ parts

$51.184

100+ parts

-

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1,091

$51.184

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Corphita

USA . 5,432 parts In-Stock

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5,432

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Parana Technologies

USA . 1,351 parts In-Stock

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$2.896

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1,351

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$2.896

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Supply Digital

USA . 966 parts In-Stock

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966

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Overview

Unlock unparalleled reliability and performance with the STMicroelectronics 5962-8606305YX EPROM. Crafted from robust ceramic and metal-sealed materials, this military-grade memory solution excels in extreme environments, boasting a wide temperature range of -55 °C to 125 °C. Ideal for demanding applications in aerospace, automotive, and industrial sectors, it ensures data integrity and swift access times, empowering your projects with cutting-edge technology that stands the test of time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package provides superior durability and protection against environmental factors, making it ideal for reliable long-term performance.

Surface Mount: YES

Featuring surface mount capability, this EPROM allows for easier integration into compact designs, saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape is conducive for optimal space utilization on boards, which can be advantageous for high-density applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies the timing requirements, which can lead to easier system design and functionality.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V ensures compatibility with standard systems, enhancing usability across various applications.

No. of Terminals: 32

With 32 terminals, this chip provides ample connections for efficient data handling and operational flexibility.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window allows for easy observation of the chip, facilitating easy testing and diagnostics.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C indicates robust performance in high-temperature environments, suitable for military and industrial applications.

Organization: 32KX8

The 32Kx8 organization provides efficient memory usage, making it suitable for a variety of data storage applications.

Minimum Operating Temperature: -55 °C

Designed to operate in extreme cold environments (-55 °C), this EPROM is ideal for aerospace, military, and other rugged applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures better solderability and reliability in connection, enhancing the product's performance in assembly.

Terminal Position: QUAD

The quad terminal position allows for versatile layouts and connections, facilitating integration into different circuit designs.

Maximum Seated Height: 3.556 mm

The compact height minimizes space requirements on printed circuit boards, making it a practical choice for space-sensitive applications.

Width: 11.43 mm

The 11.43 mm width contributes to its compact size, making it easier to fit into densely packed electronic designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V allows for operational flexibility in various electronic environments.

Length: 13.97 mm

At 13.97 mm long, this product is designed to fit well within standard package dimensions, enhancing compatibility with existing designs.

Temperature Grade: MILITARY

The military-grade temperature rating guarantees reliability and performance in demanding and rigorous environments.

Technology: CMOS

CMOS technology ensures low power consumption, longer battery life, and high-speed operation—ideal for modern electronic applications.

Parallel or Serial: PARALLEL

Support for parallel operation allows for faster data access, making it suitable for applications requiring high-speed read/write cycles.

Terminal Form: NO LEAD

The no-lead terminal form reduces space requirements and supports improved thermal performance, essential for compact designs.

No. of Words: 32768 words

With 32K words of storage capacity, it offers significant data storage for a variety of applications, enhancing functionality.

Memory Width: 8

An 8-bit memory width facilitates efficient data handling, making it an effective choice for modern computing requirements.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for standard PCB footprints, making integration into existing designs straightforward.

No. of Words Code: 32K

This 32K word code ensures ample storage and efficient processing capabilities for both simple and complex applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility in power supply choices, suitable for various embedded systems.

Memory Density: 262144 bit

With a memory density of 262144 bits, this chip delivers a good balance of capacity and performance, accommodating more data in a smaller footprint.

Memory IC Type: UVPROM

The UVPROM type offers erasable and reprogrammable features, allowing for flexibility in development and adjustments during the product lifecycle.

Maximum Access Time: 150 ns

The 150 ns maximum access time ensures high-speed data retrieval, making this EPROM suitable for time-critical applications.

Technical Specifications

EPROM 5962-8606305YX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

JESD-30 Code:

R-CQCC-N32

JESD-609 Code:

e0

Length:

13.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.556 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-8606305YX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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