Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EFR32BG21A010F1024IM32-B by Silicon Labs is a 3V Telecom IC with 2Mbps data rate. Operating b/w -40 to 125°C, it's ideal for automotive applications. With a compact square package and 32 terminals, it's suitable for telecom circuit designs.
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The surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in the design.
The square package shape is commonly used in telecom interface ICs, providing a stable and secure housing for the components.
Having 32 terminals allows for a high level of connectivity and functionality in the telecom interface IC, accommodating various input and output signals.
With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for demanding telecom applications.
The ability to operate at a minimum temperature of -40°C ensures reliability and performance in a wide range of environments.
Operating at a nominal supply voltage of 3 volts makes this telecom interface IC energy-efficient and suitable for low-power applications.
With a data rate of 2 Mbps, this telecom IC can handle high-speed data transmission, making it ideal for telecommunications and networking applications.
Other Function Telecom Interface ICs EFR32BG21A010F1024IM32-B attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs
Data Rate:
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
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Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
Width:
EFR32BG21A010F1024IM32-B Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - EFR32xG21 27/Oct/2020 EFR32xG2x/BGx2x0Px/MGM2x0Px 13/Jul/2022
PCN Assembly/Origin - Assembly Site 01/Feb/2023
PCN Packaging - IC/SIP MOQ Chg 11/Jan/2022 Labeling Change 14/Dec/2021
Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM2931AZ-5.0RAG
LM2931AZ-5.0RAG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage, 0.1A max output current, and 0.6V max dropout voltage. Ideal for applications requiring stable voltage regulation in temperature-sensitive environments up to 150°C.
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Changzhou Galaxy Century Microelectronics
Rectron
Good-ark Electronics
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
Pro-an Electronic
Itt Semiconductor
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
1N4148WS
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BQ51003YFPR
Texas Instruments
BQ51003YFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a battery supply of 5V. With a very thin profile and fine pitch, it's ideal for industrial telecom circuits requiring precise power management.
ISP1507-AX-JT
Insight Sip
ISP1507-AX-JT by Insight Sip is a telecom IC with 62 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and nominal voltage of 3V. Ideal for industrial applications requiring high-speed communication in compact form factor.
HMC641ALP4E
Analog Devices
Analog Devices' HMC641ALP4E is a 24-terminal telecom IC with -40 to 85°C operating range. It features matte tin finish, quad terminal position, and 0.5mm pitch. Ideal for telecom circuits, this chip carrier has a very thin profile and is suitable for industrial applications.
BGM113A256V21R
Silicon Labs
BGM113A256V21R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C, and nominal voltage of 3.3V. It is designed for industrial applications requiring a surface mount rectangular package style with a seated height of 2mm.
ATECC508A-SSHDA-T
Microchip Technology
Microchip ATECC508A-SSHDA-T is a telecom IC with 1 function, operating at -40 to 85°C. It features CMOS technology, 3.6V supply voltage, and TS16949 screening level. Ideal for telecom circuits, this small outline package has 8 terminals in a rectangular shape for surface mount applications.
CC1125RHBT
CC1125RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 3V. It has a data rate of 0.2 Mbps and can withstand temperatures from -40 to 85°C. This chip carrier package is ideal for industrial telecom applications requiring a compact design and surface mount capability.
LTC5596IDC#TRMPBF
LTC5596IDC#TRMPBF by Analog Devices is a Telecom IC with 8 terminals, matte tin finish, and 3.3V supply voltage. It is a small outline package suitable for telecom circuit applications requiring a compact design with a 0.5mm terminal pitch.
ANNA-B112-00B
U-blox Ag
ANNA-B112-00B by U-blox Ag is a telecom IC with 52 terminals, operating at -40 to 85°C. It has a data rate of 2 Mbps and nominal voltage of 3V. This square-shaped, surface-mount package is ideal for industrial applications requiring high-speed telecom circuit functionality.
NEO-M8P-2-11
NEO-M8P-2-11 by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85 °C. It features AEC-Q100 screening level and TS 16949 certification. Ideal for industrial applications requiring precise positioning and reliable communication.
TUSB211IRWBR
TUSB211IRWBR by Texas Instruments is a telecom IC with 480.24 Mbps data rate, operating at -40 to 85 °C. It features a 12-terminal chip carrier package suitable for industrial applications requiring a 3.3 V supply voltage and low current consumption of 0.02 mA.
MAX7042ATJ+
Analog Devices' MAX7042ATJ+ is a CMOS Telecom IC with 32 terminals in a square chip carrier package. It operates at -40 to 125 °C, with power supplies of 3/5 V. Ideal for automotive applications, it has a low supply current of 0.0092 mA and terminal pitch of 0.5 mm.
CC2640R2FRHBR
CC2640R2FRHBR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel palladium gold terminal finish and very thin profile packaging.
BT840X
Fanstel
BT840X by Fanstel is a surface mount telecom IC with 61 terminals. It operates b/w -40°C to 85°C, has a nominal voltage of 3.3V, and supports data rates up to 2 Mbps. Ideal for applications requiring high-speed telecommunications in compact electronic assemblies.
L76-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L76-M33 is a surface mount telecom IC with 18 terminals. Operating temperature range from -40 to 85°C, ideal for industrial applications. Compact package size of 10.1mm x 9.7mm x 2.5mm makes it suitable for various telecom interface functions.
MGM240PB32VNA3
TELECOM CIRCUIT;
ODIN-W260-06B
Other Telecom ICs;
WT32I-A-AI6
The Silicon Labs WT32I-A-AI6 is a surface mount telecom IC with 50 terminals. It operates in industrial temperature range (-40 to 85°C) and has a compact rectangular package (15.9mm x 23.9mm). Ideal for telecom circuit applications due to its small form factor and no-lead terminal design.
XB3-24Z8PT
Digi International
The Digi International XB3-24Z8PT is a telecom IC with 20 terminals in a MICROELECTRONIC ASSEMBLY package. It operates in temperatures ranging from -40°C to 85°C, making it suitable for industrial applications requiring reliable telecom circuit connections. The terminal form is THROUGH-HOLE, ideal for robust and secure installations.
RFSA3513TR7
Rf Micro Devices
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
XB3-24ARM
The Digi International XB3-24ARM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40°C to 85°C, making it suitable for various telecom applications. The RECTANGULAR package style and SPECIAL SHAPE design enhance its performance in Other Function Telecom Interface ICs.
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EFR32BG22C224F512IM40-C
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN;
EFR32BG22C224F512GM40-C
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260;
EFR32BG22C222F352GM40-C
TELECOM CIRCUIT; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
EFR32BG22C224F512GM32-C
TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40;
EFR32BG22C224F512IM32-C
EFR32BG22C222F352GM32-C
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 2;
EFR32BG22C224F512GN32-C
TELECOM CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
EFR32BG22C222F352GN32-C
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e4;
EFR32BG13P632F512GM48-B
EFR32BG13P732F512GM48-B
EFR32BG12P432F1024GM48-B
TELECOM CIRCUIT; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
EFR32BG1P332F256GJ43-C0
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 43; Package Code: VFBGA; Package Shape: RECTANGULAR;
EFR32BG1V132F256GJ43-C0
EFR32BG13P532F512GM48-B
EFR32BG21A010F512IM32-B
EFR32BG21A010F512IM32-B by Silicon Labs is a Telecom IC with 2 Mbps data rate, operating at -40 to 125 °C. It features a square shape, 32 terminals, and automotive temperature grade. Ideal for telecom applications requiring low power consumption and high-speed data transmission.
EFR32BG12P432F1024GL125-B
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
EFR32BG13P732F512GM32-D
EFR32BG13P732F512GM32-D by Silicon Labs is a telecom IC with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3, suitable for industrial applications requiring a compact chip carrier package with very thin profile and no-lead terminal form.
EFR32BG13P732F512GM48-D
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
EFR32BG1B232F256GJ43-C0
EFR32BG21A010F768IM32-B
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
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