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EFR32BG13P732F512GM32-D

Silicon Labs

EFR32BG13P732F512GM32-D by Silicon Labs

EFR32BG13P732F512GM32-D by Silicon Labs is a telecom IC with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.3V and MSL level of 3, suitable for industrial applications requiring a compact chip carrier package with very thin profile and no-lead terminal form.

Median Price

$5.700

Lifecycle Status

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10

In-Stock Inventory

1k+

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Arrow

USA . 1,465 parts In-Stock

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Chip1Stop

Japan . 1,468 parts In-Stock

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DigiKey

USA . 7,958 parts In-Stock

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$7.170

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$5.426

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$4.783

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$4.682

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$4.682

Verical

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Digiode

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Bristol Electronics

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$3.309

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$3.027

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Vyrian

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Dan-Mar Components

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ACDS - Activité Composants Distribution Service

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Nova Conductors

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Corphita

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Ampacity Inc.

Singapore . 3,175 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 58 parts In-Stock

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$9.633

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Continental Prestige Electronics

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Overview

Experience seamless connectivity with the EFR32BG13P732F512GM32-D by Silicon Labs, a versatile Other Function Telecom Interface IC that offers unparalleled quality and reliability. With a wide range of applications in the telecom industry, this product ensures high-performance and efficiency. Benefit from its advanced features and superior technology, providing value and convenience to customers looking for top-notch solutions. Trust Silicon Labs to deliver excellence in every aspect, making your connectivity needs effortless and efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mount allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the PCB.

No. of Terminals: 48

With 48 terminals, this product offers versatility and compatibility for various telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles results in efficient thermal management and a slim profile for space-constrained designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stability and performance even in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables reliable operation in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position provides a secure connection and ease of installation on the PCB.

Maximum Seated Height: 0.9 mm

The low maximum seated height allows for a slim and compact overall package size.

Width: 7 mm

The 7 mm width offers compatibility with standard PCB layouts for easy integration.

Maximum Time At Peak Reflow Temperature (s): 40

The 40-second maximum time at peak reflow temperature ensures proper soldering and joint integrity during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes.

Length: 7 mm

The 7 mm length provides a balanced form factor for optimal placement on the PCB.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and simplifies the recycling process.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and functionality.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources in telecom applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for precise connections and compatibility with standard PCB layouts.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand exposure to moderate levels of humidity during storage and operation.

Technical Specifications

Other Function Telecom Interface ICs EFR32BG13P732F512GM32-D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Silicon Labs

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

EFR32BG13P732F512GM32-D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Silicon Labs

Silicon Laboratories, Inc. (Silicon Labs) is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide. It is headquartered in Austin, Texas, United States. The company focuses on microcontrollers (MCUs) and wireless system on chips (SoCs) and modules. The company also produces software stacks including firmware libraries and protocol-based software, and a free software development platform called Simplicity Studio. Silicon Labs was founded in 1996 and released its first product, an updated DAA design that enabled manufacturers to reduce the size and cost of a modem, two years later. During its first three years, the company focused on RF and CMOS integration, and developed the world's first CMOS RF synthesizer for mobile phones which was released in 1999. Following the appointment of Tyson Tuttle as the CEO in 2012, Silicon Labs has increasingly focused on developing technologies for the IoT market, which in 2019 accounted for more than 50 percent of the company's revenue, but in 2020 had increased to about 58 percent. In 1998, Silicon Labs released its first product, an updated Direct Access Arrangement (DAA) design that enabled manufacturers to reduce the size and cost of a modem.

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