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STK400-110

Onsemi

STK400-110 by Onsemi

STK400-110 by Onsemi is an audio amplifier IC with 3 functions, 22 terminals at 2.54mm pitch. It is a hybrid technology used in audio and video amplifiers for single terminal position applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,396 parts In-Stock

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1,396

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Digiode

USA . 1,377 parts In-Stock

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1,377

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 7,181 parts In-Stock

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7,181

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SupplyDigital Components

Austria . 6,504 parts In-Stock

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6,504

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TANS Electronics

Latvia . 3,870 parts In-Stock

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3,870

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Kulean Microsystems

USA . 3,538 parts In-Stock

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3,538

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UHIMA Technologies

Türkiye . 680 parts In-Stock

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680

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Corohmni

South Africa . 434 parts In-Stock

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434

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Corphita

USA . 303 parts In-Stock

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303

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Overview

Unleash the power of audio and video with the STK400-110 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. The STK400-110 is ideal for various applications in the Audio & Video Amplifiers category. With 3 functions packed into one sleek design, this hybrid technology amplifier offers unmatched value and benefits to customers. Elevate your sound experience today with the STK400-110.

Feature Benefit Bullets

No. of Functions: 3

Having 3 functions in one amplifier means that this product is versatile and can cater to a variety of audio needs without needing multiple devices.

General IC Type: AUDIO AMPLIFIER

Being an audio amplifier specifically designed for audio signals ensures high-quality sound output and optimized performance for audio applications.

No. of Terminals: 22

With 22 terminals, this amplifier allows for easy connectivity to various audio sources and output devices, offering flexibility in setup and configuration.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces potential wiring errors, making this amplifier user-friendly and easy to set up.

Technology: HYBRID

The hybrid technology used in this amplifier combines the advantages of different technologies, leading to improved performance, efficiency, and reliability.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for precise and secure connections, reducing the risk of signal interference or loss, and ensuring a stable and consistent audio output.

Technical Specifications

Audio & Video Amplifiers STK400-110 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

3

No. of Terminals:

22

Package Equivalence Code:

SIP22,.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK400-110 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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