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STK400-450

Onsemi

STK400-450 by Onsemi

STK400-450 by Onsemi is a hybrid audio amplifier with 30W output power, 0.08% harmonic distortion, and 0.05 kHz bandwidth. It has 22 terminals in a rectangular package for audio and video applications requiring high-quality sound amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,304 parts In-Stock

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Vyrian

USA . 758 parts In-Stock

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758

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SupplyDigital Components

Austria . 5,658 parts In-Stock

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Problanco Electronics

Mexico . 4,365 parts In-Stock

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Kulean Microsystems

USA . 2,291 parts In-Stock

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Corphita

USA . 2,184 parts In-Stock

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TANS Electronics

Latvia . 1,880 parts In-Stock

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Corohmni

South Africa . 191 parts In-Stock

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UHIMA Technologies

Türkiye . 136 parts In-Stock

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Overview

Elevate your audio experience with the STK400-450 by Onsemi. Crafted with precision and expertise, this audio amplifier delivers exceptional quality and performance that sets it apart from the rest. Whether you're a music enthusiast or a professional in the entertainment industry, this product offers unmatched value and benefits. Perfect for a wide range of applications, its hybrid technology ensures crystal-clear sound and powerful output. Upgrade your audio system today with the STK400-450 and immerse yourself in a world of superior sound quality.

Feature Benefit Bullets

Surface Mount: YES

Easy installation and space-saving design make it suitable for compact audio setups.

Package Shape: RECTANGULAR

Allows for efficient placement and connectivity within audio systems.

General IC Type: AUDIO AMPLIFIER

Specifically designed for amplifying audio signals, ensuring optimal performance in audio applications.

Harmonic Distortion: 0.08 %

Low distortion results in high-quality audio output with minimal signal interference.

No. of Terminals: 22

Sufficient number of terminals allow for versatile connectivity options in audio setups.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Advanced packaging technology ensures reliable performance and durability of the amplifier.

Terminal Position: SINGLE

Simplified terminal layout facilitates easy installation and connection of the amplifier.

Nominal Output Power: 30 W

Ample power output for driving speakers and maintaining audio clarity at various volume levels.

No. of Channels: 3

Supports multiple audio channels for immersive sound reproduction in multi-speaker setups.

Technology: HYBRID

Hybrid technology combines the benefits of different amplifier types for optimal audio performance.

Nominal Bandwidth: 0.05 kHz

Wide bandwidth ensures accurate reproduction of audio frequencies for lifelike sound quality.

Terminal Form: GULL WING

Gull wing terminals offer secure connections and easy soldering for reliable operation of the amplifier.

Technical Specifications

Audio & Video Amplifiers STK400-450 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.05 kHz

General IC Type:

Harmonic Distortion:

.08 %

JESD-30 Code:

R-XSFM-G22

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

22

Nominal Output Power:

30 W

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

YES

Technology:

HYBRID

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

STK400-450 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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