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STK400-500

Onsemi

STK400-500 by Onsemi

The Onsemi STK400-500 is a hybrid audio amplifier IC with 3 channels and 60W nominal output power. It features low harmonic distortion of 0.08% and a wide bandwidth of 0.05 kHz, making it ideal for high-quality audio applications in surface-mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,193 parts In-Stock

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Vyrian

USA . 465 parts In-Stock

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465

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Problanco Electronics

Mexico . 6,269 parts In-Stock

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6,269

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TANS Electronics

Latvia . 4,367 parts In-Stock

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SupplyDigital Components

Austria . 4,279 parts In-Stock

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Kulean Microsystems

USA . 2,871 parts In-Stock

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Corphita

USA . 916 parts In-Stock

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916

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UHIMA Technologies

Türkiye . 284 parts In-Stock

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Corohmni

South Africa . 56 parts In-Stock

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Overview

Elevate your audio experience with the STK400-500 by Onsemi. Designed for superior performance and reliability, this audio amplifier offers crystal-clear sound quality and powerful output, making it perfect for a wide range of applications. With its advanced hybrid technology and sleek rectangular package shape, this amplifier delivers unmatched value and benefits to customers. Whether you're looking to enhance your home entertainment system or upgrade your professional sound setup, the STK400-500 is the perfect choice for all your audio amplification needs. Trust Onsemi to provide exceptional quality and innovation in every product they offer.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and compact design, making it suitable for small spaces and efficient PCB layouts.

Package Shape: RECTANGULAR

Rectangular package shape provides stability and ease of mounting, ensuring secure placement on the circuit board.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output for audio applications.

Harmonic Distortion: 0.08 %

Low harmonic distortion value indicates accurate sound reproduction with minimal interference or noise.

No. of Terminals: 22

Having a higher number of terminals allows for greater connectivity options and flexibility in circuit design.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly offers precise and reliable construction for enhanced performance and durability.

Terminal Position: SINGLE

Single terminal position simplifies connections and reduces the chance of errors during installation.

Nominal Output Power: 60 W

A higher nominal output power of 60 W ensures sufficient power for driving speakers and delivering loud and clear audio.

No. of Channels: 3

Three channels provide the versatility to connect multiple audio sources or speakers, enhancing the overall audio experience.

Technology: HYBRID

Hybrid technology combines the best features of different amplifier designs for improved performance and efficiency.

Nominal Bandwidth: 0.05 kHz

A wide nominal bandwidth of 0.05 kHz allows the amplifier to accurately reproduce a broad range of audio frequencies.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure soldering and reliable connection, reducing the risk of loose connections or signal loss.

Technical Specifications

Audio & Video Amplifiers STK400-500 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.05 kHz

General IC Type:

Harmonic Distortion:

.08 %

JESD-30 Code:

R-XSFM-G22

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

22

Nominal Output Power:

60 W

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

YES

Technology:

HYBRID

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

STK400-500 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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