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STK400-520

Onsemi

STK400-520 by Onsemi

STK400-520 by Onsemi is a hybrid audio amplifier with 80W output power and 0.08% harmonic distortion. It features 3 channels, 0.05 kHz bandwidth, and 22 terminals in a rectangular surface-mount package. Ideal for high-quality audio applications requiring multiple channels and low distortion levels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,376 parts In-Stock

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Digiode

USA . 232 parts In-Stock

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232

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SupplyDigital Components

Austria . 6,377 parts In-Stock

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6,377

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Problanco Electronics

Mexico . 4,108 parts In-Stock

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Kulean Microsystems

USA . 3,469 parts In-Stock

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Corphita

USA . 1,804 parts In-Stock

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TANS Electronics

Latvia . 1,086 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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Overview

Unleash the power of crystal-clear audio with the STK400-520 by Onsemi. As a leader in the industry, Onsemi delivers top-notch quality and reliability in their products. The STK400-520, a versatile audio amplifier, is perfect for a wide range of applications. Whether you're setting up a home theater system or enhancing your car stereo, this amplifier offers unmatched value and performance. Experience the difference with the STK400-520 and elevate your audio experience today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs during production.

Package Shape: RECTANGULAR

Rectangular package shape helps in efficient PCB layout and space utilization, making it suitable for compact designs.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification, this product ensures high-quality sound output with minimal distortion.

Harmonic Distortion: 0.08%

Low harmonic distortion ensures accurate reproduction of audio signals, resulting in clear and natural sound output.

No. of Terminals: 22

Having a sufficient number of terminals allows for versatile connectivity options and customization in audio setups.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly package style ensures compact size and efficient heat dissipation for reliable performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and wiring, reducing the chances of errors and ensuring a straightforward setup process.

Nominal Output Power: 80 W

With a high nominal output power of 80W, this amplifier can drive speakers with ease, delivering powerful and dynamic sound output.

No. of Channels: 3

Supporting three channels allows for creating a multi-speaker setup or driving multiple audio sources simultaneously, enhancing the audio experience.

Technology: HYBRID

Hybrid technology combines the benefits of different amplifier technologies, offering a balance of efficiency, power, and audio quality.

Nominal Bandwidth: 0.05 kHz

Wide nominal bandwidth ensures that the amplifier can accurately reproduce a wide range of audio frequencies, resulting in detailed sound output.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections while also facilitating automated assembly processes for increased efficiency.

Technical Specifications

Audio & Video Amplifiers STK400-520 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.05 kHz

General IC Type:

Harmonic Distortion:

.08 %

JESD-30 Code:

R-XSFM-G22

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

22

Nominal Output Power:

80 W

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

YES

Technology:

HYBRID

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

STK400-520 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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