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STK400-230

Onsemi

STK400-230 by Onsemi

STK400-230 by Onsemi is an Audio Amplifier IC with 3 functions, 22 terminals at 2.54mm pitch. Its hybrid technology makes it ideal for audio and video amplifier applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,046 parts In-Stock

1+ parts

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2,046

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Vyrian

USA . 1,575 parts In-Stock

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1,575

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 6,524 parts In-Stock

1+ parts

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6,524

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Problanco Electronics

Mexico . 5,745 parts In-Stock

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5,745

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Kulean Microsystems

USA . 3,270 parts In-Stock

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3,270

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SupplyDigital Components

Austria . 1,926 parts In-Stock

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1,926

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Corphita

USA . 1,203 parts In-Stock

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1,203

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UHIMA Technologies

Türkiye . 954 parts In-Stock

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954

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Corohmni

South Africa . 271 parts In-Stock

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271

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Overview

Elevate your audio experience with the STK400-230 by Onsemi. Crafted with precision and expertise, this audio amplifier offers top-notch quality and performance that exceeds expectations. Perfect for a wide range of applications in the audio and video industry, this product boasts three functions packed into a sleek design. With Onsemi's reputation for reliability and innovation, you can trust that the STK400-230 delivers exceptional value, benefits, and advantages to elevate your sound system to new heights. Experience the difference with Onsemi's superior technology at your fingertips.

Feature Benefit Bullets

No. of Functions: 3

Having multiple functions in one amplifier allows for versatile use and customization, making this product a powerful and flexible choice for audio amplification needs.

General IC Type: AUDIO AMPLIFIER

The specific IC type of audio amplifier indicates that this product is designed and optimized for audio applications, ensuring high-quality sound output and reliable performance.

No. of Terminals: 22

With a higher number of terminals, this amplifier offers more connectivity options and compatibility with a variety of audio devices, making it suitable for complex audio setups and systems.

Terminal Position: SINGLE

Single terminal positioning simplifies installation and wiring processes, making it user-friendly and convenient for users to set up and connect this amplifier in their audio system.

Technology: HYBRID

The hybrid technology used in this amplifier combines the best features of different technologies, resulting in improved performance, efficiency, and versatility, making it a superior choice for audio amplification.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm offers compatibility with a wide range of connectors and components, making it easy to integrate this amplifier into existing audio setups or projects.

Technical Specifications

Audio & Video Amplifiers STK400-230 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

3

No. of Terminals:

22

Package Equivalence Code:

SIP22,.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK400-230 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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