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STK400-510

Onsemi

STK400-510 by Onsemi

STK400-510 by Onsemi is a hybrid audio amplifier with 70W output power, 0.08% harmonic distortion, and 0.05 kHz bandwidth. Ideal for audio applications, it features 3 channels and 22 terminals in a surface-mount rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,588 parts In-Stock

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Digiode

USA . 1,046 parts In-Stock

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1,046

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Problanco Electronics

Mexico . 8,021 parts In-Stock

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8,021

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SupplyDigital Components

Austria . 4,070 parts In-Stock

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4,070

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TANS Electronics

Latvia . 2,029 parts In-Stock

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2,029

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Corphita

USA . 1,764 parts In-Stock

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Kulean Microsystems

USA . 884 parts In-Stock

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884

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UHIMA Technologies

Türkiye . 408 parts In-Stock

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408

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Corohmni

South Africa . 262 parts In-Stock

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Overview

Enhance your audio and video experience with the STK400-510 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that guarantee superior performance and reliability. This audio amplifier is perfect for a wide range of applications, offering customers clear sound, minimal distortion, and powerful output. With its innovative technology and sleek design, the STK400-510 provides exceptional value and benefits that will elevate your audio and video system to the next level. Upgrade your entertainment setup today with the STK400-510 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape can often fit better in tight spaces and is commonly used in electronic components for efficient layout and design.

General IC Type: AUDIO AMPLIFIER

Specifically designed as an audio amplifier, ensuring high-quality sound output and performance for audio applications.

Harmonic Distortion: 0.08%

Low harmonic distortion (0.08%) results in clean and clear audio signals without unwanted noise or interference.

No. of Terminals: 22

The ample number of terminals allows for multiple connections and configurations, making it highly versatile for various audio setups.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Microelectronic assembly packaging provides a high level of protection and reliability for the components, ensuring long-term performance.

Terminal Position: SINGLE

Single terminal position simplifies installation and connections, reducing the chances of error and making the product user-friendly.

Nominal Output Power: 70 W

With a nominal output power of 70W, this amplifier can deliver powerful and robust audio output, suitable for various applications.

No. of Channels: 3

Three channels provide the flexibility to connect multiple audio sources and drive multiple speakers or zones, enhancing the overall audio experience.

Technology: HYBRID

Hybrid technology combines the best features of different amplifier types, offering improved performance, efficiency, and reliability.

Nominal Bandwidth: 0.05 kHz

With a wide nominal bandwidth of 0.05 kHz, this amplifier can reproduce a broad range of frequencies accurately, ensuring a full and balanced audio experience.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, preventing loosening or disconnection during operation, ensuring consistent performance.

Technical Specifications

Audio & Video Amplifiers STK400-510 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

Nominal Bandwidth:

.05 kHz

General IC Type:

Harmonic Distortion:

.08 %

JESD-30 Code:

R-XSFM-G22

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

22

Nominal Output Power:

70 W

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Surface Mount:

YES

Technology:

HYBRID

Terminal Form:

Terminal Position:

SINGLE

Trade Compliance

STK400-510 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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