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STK400-210

Onsemi

STK400-210 by Onsemi

STK400-210 by Onsemi is an audio amplifier IC with 3 functions, 22 terminals at 2.54mm pitch. It is a hybrid technology suitable for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,013 parts In-Stock

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Vyrian

USA . 836 parts In-Stock

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836

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SupplyDigital Components

Austria . 7,727 parts In-Stock

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Kulean Microsystems

USA . 6,077 parts In-Stock

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TANS Electronics

Latvia . 4,844 parts In-Stock

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Problanco Electronics

Mexico . 3,346 parts In-Stock

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Corphita

USA . 1,576 parts In-Stock

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UHIMA Technologies

Türkiye . 301 parts In-Stock

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Corohmni

South Africa . 295 parts In-Stock

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Overview

Elevate your audio experience with the STK400-210 by Onsemi. This high-quality audio amplifier offers customers unparalleled sound quality and performance. Manufactured by Onsemi, a trusted name in the industry, this product is designed to meet all your audio amplification needs. With three functions packed into one sleek device, the STK400-210 is perfect for a wide range of applications in the audio and video world. Upgrade your audio setup today with the STK400-210 and enjoy the benefits of superior sound quality and reliable performance.

Feature Benefit Bullets

No. of Functions: 3

Having multiple functions allows for versatility and flexibility in how the audio amplifier can be used, making it suitable for a variety of applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification ensures high-quality sound output and optimal performance for audio-related tasks.

No. of Terminals: 22

Having a higher number of terminals provides more connection options and compatibility with a wide range of devices and configurations.

Terminal Position: SINGLE

Having a single terminal position simplifies installation and setup, making it easier to integrate into audio systems.

Technology: HYBRID

Hybrid technology combines the best of different technologies, often resulting in improved performance, efficiency, and reliability for the audio amplifier.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm ensures compatibility with commonly used connectors and makes it easier to connect and disconnect the audio amplifier.

Technical Specifications

Audio & Video Amplifiers STK400-210 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

3

No. of Terminals:

22

Package Equivalence Code:

SIP22,.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK400-210 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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