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STK400-260

Onsemi

STK400-260 by Onsemi

STK400-260 by Onsemi is an audio amplifier IC with 3 functions, 22 terminals at 2.54mm pitch. It is a hybrid technology suitable for audio and video amplification applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 971 parts In-Stock

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Digiode

USA . 170 parts In-Stock

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170

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TANS Electronics

Latvia . 8,298 parts In-Stock

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Problanco Electronics

Mexico . 6,431 parts In-Stock

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SupplyDigital Components

Austria . 6,207 parts In-Stock

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Kulean Microsystems

USA . 3,490 parts In-Stock

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Corphita

USA . 564 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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UHIMA Technologies

Türkiye . 125 parts In-Stock

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Overview

Elevate your audio experience with the STK400-260 by Onsemi. With a reputation for quality and innovation, Onsemi delivers cutting-edge technology in the field of Audio & Video Amplifiers. The STK400-260 boasts 3 functions in a single hybrid IC, offering unparalleled performance and reliability. Whether you're looking to enhance your home entertainment system or upgrade your car audio, this amplifier is sure to exceed your expectations. Trust Onsemi to provide the value, benefits, and advantages you need for your audio needs.

Feature Benefit Bullets

No. of Functions: 3

Having multiple functions allows for versatility and flexibility in usage, making this amplifier suitable for various audio applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures optimal sound quality and performance for audio amplification needs.

No. of Terminals: 22

Having a higher number of terminals allows for more connectivity options and customization, making it easier to integrate into different audio setups.

Terminal Position: SINGLE

The single terminal position simplifies installation and wiring, reducing potential complications in setup and maintenance.

Technology: HYBRID

Hybrid technology combines the benefits of different amplifier technologies, providing improved efficiency and performance compared to traditional single type amplifiers.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for compatibility with a wide range of connectors and components, ensuring easy integration and connectivity.

Technical Specifications

Audio & Video Amplifiers STK400-260 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

3

No. of Terminals:

22

Package Equivalence Code:

SIP22,.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK400-260 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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