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STK400-250

Onsemi

STK400-250 by Onsemi

STK400-250 by Onsemi is an audio amplifier IC with 3 functions, 22 terminals at 2.54mm pitch. Its hybrid technology makes it ideal for audio and video amplification applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,333 parts In-Stock

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2,333

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Vyrian

USA . 269 parts In-Stock

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269

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,170 parts In-Stock

1+ parts

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7,170

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TANS Electronics

Latvia . 4,275 parts In-Stock

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4,275

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Corphita

USA . 1,220 parts In-Stock

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1,220

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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979

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Corohmni

South Africa . 499 parts In-Stock

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499

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Kulean Microsystems

USA . 400 parts In-Stock

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400

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Problanco Electronics

Mexico . 291 parts In-Stock

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291

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Overview

Transform your audio and video experience with the STK400-250 by Onsemi. Known for their superior quality and innovative designs, Onsemi delivers top-notch audio amplifiers that cater to a wide range of applications. Whether you're a music enthusiast or a tech-savvy professional, this hybrid technology amplifier offers unparalleled value, benefits, and advantages that will enhance your listening and viewing pleasure. Upgrade your sound system today with the STK400-250 and immerse yourself in premium audio quality like never before.

Feature Benefit Bullets

No. of Functions: 3

Having 3 functions in one device provides versatility and saves space by eliminating the need for multiple separate components.

General IC Type: AUDIO AMPLIFIER

Being a specialized audio amplifier, this product is designed to deliver high-quality audio output with enhanced sound clarity and power.

No. of Terminals: 22

With 22 terminals, this amplifier offers extensive connectivity options for various input and output devices, making it suitable for a wide range of applications.

Terminal Position: SINGLE

Single terminal position ensures ease of installation and connectivity, simplifying the setup process for users and reducing the chances of errors.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies, resulting in improved performance, efficiency, and reliability of the amplifier.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy integration with other electronic components, facilitating seamless system integration and compatibility.

Technical Specifications

Audio & Video Amplifiers STK400-250 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

3

No. of Terminals:

22

Package Equivalence Code:

SIP22,.2

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Surface Mount:

NO

Technology:

HYBRID

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

STK400-250 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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