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TDA8541TD-T

NXP Semiconductors

TDA8541TD-T by NXP Semiconductors

AUDIO AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,273 parts In-Stock

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Anansix

USA . 2,626 parts In-Stock

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Vyrian

USA . 1,122 parts In-Stock

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Nova Conductors

Japan . 66 parts In-Stock

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Corohmni

South Africa . 70 parts In-Stock

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$0.607

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Aztec Data Supply Inc.

USA . 4,507 parts In-Stock

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$3.720

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Semicontronic

India . 931 parts In-Stock

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$9.800

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$9.555

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$9.506

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931

$9.800

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One Stop Electronics

USA . 1,415 parts In-Stock

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$12.800

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Ampacity Inc.

Singapore . 190 parts In-Stock

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$13.800

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AZTECH Wire

Italy . 473 parts In-Stock

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$16.967

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Argo Parts USA

USA . 4,990 parts In-Stock

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Corphita

USA . 4,461 parts In-Stock

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Continental Prestige Electronics

USA . 3,778 parts In-Stock

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UNI Independent Distributors

Spain . 1,048 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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Technical Specifications

Audio & Video Amplifiers TDA8541TD-T attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1.2 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

TDA8541TD-T General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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