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NVTFWS012P03P8ZTAG

Onsemi

NVTFWS012P03P8ZTAG by Onsemi

NVTFWS012P03P8ZTAG by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 47A IDM, 0.02 ohm Drain-Source Resistance, and operates in ENHANCEMENT MODE. With a compact SQUARE package and -55 to 175 °C temperature range, it's suitable for various power management needs.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 836 parts In-Stock

1+ parts

$1.250

100+ parts

$0.517

1k+ parts

$0.403

10k+ parts

$0.288

836

$1.250

$0.517

$0.403

$0.288

Distributors (In-Stock)

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Flip Electronics

USA . 10,500 parts In-Stock

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Vyrian

USA . 4,269 parts In-Stock

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Digiode

USA . 1,202 parts In-Stock

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AZTECH Wire

Italy . 599 parts In-Stock

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$10.120

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599

$10.120

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Kulean Microsystems

USA . 5,583 parts In-Stock

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5,583

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iodParts Technologies Inc.

India . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,457 parts In-Stock

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Problanco Electronics

Mexico . 1,998 parts In-Stock

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Corphita

USA . 1,035 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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TANS Electronics

Latvia . 578 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Overview

Power up your projects with the NVTFWS012P03P8ZTAG by Onsemi, a high-quality P-Channel Power Field Effect Transistor designed for switching applications. With a maximum drain current of 7A and a low on-resistance of 0.02 ohm, this transistor offers exceptional performance and reliability. Its compact square package with 8 terminals makes it easy to integrate into your designs. Trust in Onsemi's expertise in semiconductor technology to deliver superior products that meet AEC-Q101 standards. Upgrade your electronic devices with the NVTFWS012P03P8ZTAG for efficient power management and enhanced functionality.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Enhances durability and reliability of the product, suitable for various operating conditions.

Polarity or Channel Type P-CHANNEL

Efficient for switching applications and offers lower ON-state resistance.

Configuration SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and enables easy integration of the diode function.

Transistor Application SWITCHING

Designed specifically for switching applications, ensuring optimal performance.

Surface Mount YES

Allows for easy and efficient PCB assembly, saving space and enhancing reliability.

Minimum DS Breakdown Voltage 30 V

Provides a safe operating range and protection against voltage spikes.

Package Shape SQUARE

Facilitates easy mounting and heat dissipation, improving overall performance.

Terminal Form FLAT

Ensures secure and stable connections for effective transmission of electrical signals.

Operating Mode ENHANCEMENT MODE

Enables efficient control of the transistor's conductance, enhancing overall performance.

Maximum Pulsed Drain Current (IDM) 47 A

Allows for high current handling capability, suitable for demanding applications.

No. of Terminals 8

Provides versatility and flexibility in circuit connections for various applications.

Maximum Power Dissipation (Abs) 2.4 W

Can efficiently handle power dissipation, ensuring stable operation under different conditions.

Package Style (Meter) SMALL OUTLINE

Saves space on the PCB, making it suitable for compact designs and applications.

Field Effect Transistor Technology METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and reliability in performance with low leakage current.

Maximum Operating Temperature 175 °C

Ensures reliable operation even in high-temperature environments, enhancing durability.

Transistor Element Material SILICON

Provides good thermal conductivity and electrical properties, ensuring efficient operation.

Minimum Operating Temperature -55 °C

Capable of operating in low-temperature conditions, suitable for a wide range of environments.

Terminal Finish MATTE TIN

Promotes good solderability and electrical conductivity, ensuring reliable connections.

Maximum Drain Current (ID) 7 A

Can handle high continuous current, suitable for demanding applications.

Maximum Drain-Source On Resistance 0.02 ohm

Offers low ON-state resistance, reducing power loss and improving efficiency.

Terminal Position DUAL

Enhances versatility in circuit design and connection options, accommodating different configurations.

Case Connection DRAIN

Ensures efficient heat dissipation and reliable electrical connections, enhancing performance.

Maximum Time At Peak Reflow Temperature (s) 30

Optimizes the reflow soldering process, ensuring proper solder connections and reliability.

Peak Reflow Temperature °C 260

Suitable for high-temperature soldering processes, ensuring stable connections and reliability.

Maximum Feedback Capacitance (Crss) 506 pF

Optimizes high-frequency performance and stability in switching applications.

Reference Standard AEC-Q101

Complies with automotive industry standards for quality and reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NVTFWS012P03P8ZTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

506 pF

JESD-30 Code:

S-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

47 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NVTFWS012P03P8ZTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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