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NVTFS5820NLTAG

Onsemi

NVTFS5820NLTAG by Onsemi

NVTFS5820NLTAG by Onsemi is a Power FET with 60V DS Breakdown Voltage, 29A ID, and 0.0115 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Features include N-CHANNEL polarity, 247A IDM, and 48mJ EAS rating.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Chip Stock

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ComSIT Distribution GmbH

Germany . 9,678 parts In-Stock

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Vyrian

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Digiode

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Inventory MP

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Bristol Electronics

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Nova Conductors

Japan . 200 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,273 parts In-Stock

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$0.560

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AZTECH Wire

Italy . 339 parts In-Stock

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$7.218

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Ampacity Inc.

Singapore . 318 parts In-Stock

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$28.050

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Semicontronic

India . 1,151 parts In-Stock

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$47.050

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$45.874

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$45.638

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 7,331 parts In-Stock

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TANS Electronics

Latvia . 6,282 parts In-Stock

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Kulean Microsystems

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 2,014 parts In-Stock

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UHIMA Technologies

Türkiye . 948 parts In-Stock

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iodParts Technologies Inc.

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Corphita

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Corohmni

South Africa . 359 parts In-Stock

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Argo Parts USA

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Bastille Electronics

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Overview

Unleash the power of innovation with the NVTFS5820NLTAG by Onsemi! This Power Field Effect Transistor (FET) is a game-changer in the world of electronics, offering unmatched quality and reliability. With its N-CHANNEL design and built-in diode, this FET is perfect for applications requiring high performance and efficiency. Whether you're designing automotive systems or industrial equipment, this FET delivers exceptional value, benefits, and advantages to ensure your projects stand out from the rest. Trust in Onsemi's expertise and experience to take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material provides durability and protection to the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and low ON-state resistance.

Minimum DS Breakdown Voltage: 60 V

The high Minimum DS Breakdown Voltage of 60 V ensures reliable performance and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 247 A

The high Maximum Pulsed Drain Current of 247 A allows the FET to handle high current loads effectively.

Avalanche Energy Rating (EAS): 48 mJ

The high Avalanche Energy Rating of 48 mJ ensures the FET can handle sudden energy spikes without damage.

Maximum Power Dissipation (Abs): 3.2 W

The Maximum Power Dissipation of 3.2 W indicates the FET's ability to dissipate heat efficiently and operate under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of METAL-OXIDE SEMICONDUCTOR technology ensures high performance and reliability in switching applications.

Maximum Operating Temperature: 175 °C

The high Maximum Operating Temperature of 175°C allows the FET to operate in demanding environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5820NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

48 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.0115 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

247 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFS5820NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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