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NVTFS5811NLTAG

Onsemi

NVTFS5811NLTAG by Onsemi

NVTFS5811NLTAG by Onsemi is a Power FET with N-CHANNEL polarity, 40V DS breakdown voltage, and 354A pulsed drain current. It is used in applications requiring high power dissipation, such as automotive systems and industrial equipment due to its 21W max power dissipation and small outline package style.

Median Price

$0.601

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$0.601

1k+ parts

$0.499

10k+ parts

$0.445

500

-

$0.601

$0.499

$0.445

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 10,500 parts In-Stock

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10,500

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Vyrian

USA . 7,879 parts In-Stock

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7,879

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Flip Electronics

USA . 7,500 parts In-Stock

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7,500

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Digiode

USA . 77 parts In-Stock

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77

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Distributors (Availability)

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AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$20.730

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811

$20.730

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RC Electronics

USA . 81,415 parts In-Stock

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81,415

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Perfect Parts

USA . 15,230 parts In-Stock

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TANS Electronics

Latvia . 7,186 parts In-Stock

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7,186

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,318 parts In-Stock

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SupplyDigital Components

Austria . 3,805 parts In-Stock

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3,805

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Kulean Microsystems

USA . 3,248 parts In-Stock

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3,248

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ChipstoGo Electronic ltd

UK . 1,150 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 406 parts In-Stock

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Corohmni

South Africa . 164 parts In-Stock

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164

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Corphita

USA . 141 parts In-Stock

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Overview

Unlock the power of innovation with the high-quality NVTFS5811NLTAG Power Field Effect Transistor from Onsemi. Designed for efficient performance, this N-CHANNEL FET offers a single configuration with a built-in diode, making it ideal for a wide range of applications. With a maximum pulsed drain current of 354A and an avalanche energy rating of 65 mJ, this transistor delivers exceptional reliability and power handling capabilities. Experience enhanced efficiency and performance with the NVTFS5811NLTAG, setting new standards in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring durability and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in preventing reverse current flow, offering better protection for the circuit and enhancing overall efficiency.

Surface Mount: YES

Enables easy and convenient installation on a circuit board, saving space and allowing for efficient assembly processes.

Minimum DS Breakdown Voltage: 40 V

With a high breakdown voltage, this FET can handle higher voltage levels without breakdown, ensuring reliability in demanding voltage conditions.

Package Shape: SQUARE

The square shape allows for efficient use of board space and facilitates easy mounting in tight spaces.

Terminal Form: FLAT

The flat terminals make it easy to solder and provide a secure electrical connection for stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have a positive threshold voltage and require a gate voltage to turn on, offering better control and improved efficiency in applications.

Maximum Pulsed Drain Current (IDM): 354 A

High pulsed drain current capability allows for handling surge currents effectively, making it suitable for applications with transient loads.

Avalanche Energy Rating (EAS): 65 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy transients, providing robust protection for the circuit.

Maximum Drain Current (Abs) (ID): 40 A

With a high maximum drain current rating, this FET can handle high continuous currents without overheating, ensuring reliable performance.

No. of Terminals: 5

Having five terminals allows for versatile connections and versatile usage in different circuit configurations.

Maximum Power Dissipation (Abs): 21 W

The high maximum power dissipation rating indicates the FET's ability to dissipate heat effectively, preventing thermal issues and ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and enables compact designs, making it ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency, fast switching speeds, and low ON-resistance, making it suitable for high-performance applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures and operate reliably in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer good performance characteristics, high reliability, and compatibility with various manufacturing processes.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, ensuring a secure and reliable electrical connection.

Maximum Drain Current (ID): 16 A

With a high drain current rating, this FET can handle high continuous currents without overheating, ensuring stable performance in demanding applications.

Maximum Drain-Source On Resistance: 0.01 ohm

The low ON-resistance results in reduced power losses and improved efficiency in high-current applications, leading to better overall performance.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and facilitates easy connections in various circuit configurations.

Case Connection: DRAIN

The drain connection simplifies the circuit layout and allows for easy integration with other components, enhancing overall design efficiency.

Technical Specifications

Power Field Effect Transistors (FET) NVTFS5811NLTAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

65 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

354 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVTFS5811NLTAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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