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NVMFWS0D7N04XMT1G

Onsemi

NVMFWS0D7N04XMT1G by Onsemi

NVMFWS0D7N04XMT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 987mJ EAS. Ideal for power applications in automotive electronics due to AEC-Q101 standard compliance and high drain current capacity.

Median Price

$3.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 29,200 parts In-Stock

1+ parts

$3.120

100+ parts

$1.410

1k+ parts

$1.110

10k+ parts

-

29,200

$3.120

$1.410

$1.110

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DigiKey

USA . 18,599 parts In-Stock

1+ parts

$3.120

100+ parts

$1.402

1k+ parts

$1.181

10k+ parts

$0.965

18,599

$3.120

$1.402

$1.181

$0.965

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 73,979 parts In-Stock

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73,979

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Vyrian

USA . 6,625 parts In-Stock

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6,625

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Digiode

USA . 777 parts In-Stock

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777

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Distributors (Availability)

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Microchip USA

USA . 209 parts In-Stock

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$9.125

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209

$9.125

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AZTECH Wire

Italy . 105 parts In-Stock

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$18.240

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105

$18.240

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TANS Electronics

Latvia . 7,798 parts In-Stock

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7,798

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Problanco Electronics

Mexico . 4,348 parts In-Stock

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4,348

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Kulean Microsystems

USA . 3,394 parts In-Stock

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3,394

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Corphita

USA . 2,471 parts In-Stock

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SupplyDigital Components

Austria . 1,565 parts In-Stock

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UHIMA Technologies

Türkiye . 984 parts In-Stock

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984

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Corohmni

South Africa . 278 parts In-Stock

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278

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Overview

Elevate your power management capabilities with the NVMFWS0D7N04XMT1G from Onsemi. This high-quality Power FET offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this N-CHANNEL transistor with built-in diode is designed for enhanced efficiency and power handling. Whether you're looking to optimize your industrial systems or upgrade your automotive electronics, this transistor delivers exceptional value with its impressive power dissipation, low on-resistance, and reliable operation in extreme temperatures. Trust Onsemi for cutting-edge semiconductor technology that empowers your devices to perform at their best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the internal components, making this FET a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage and helps prevent damage to the FET and the circuit, increasing the overall reliability of the product.

Surface Mount: YES

Being surface mountable makes this FET easy to integrate into compact electronic devices and circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltage levels and protect the circuit from overvoltage conditions.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating of 900A allows this FET to handle short bursts of high current, making it ideal for applications with high power requirements.

Maximum Power Dissipation (Abs): 134 W

With a maximum power dissipation of 134W, this FET can efficiently dissipate heat and operate at high power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C enables this FET to operate in harsh environments and high-temperature conditions, making it suitable for a wide range of applications.

Maximum Feedback Capacitance (Crss): 112 pF

The low feedback capacitance of 112pF helps reduce the risk of parasitic capacitances in the circuit, improving overall performance and stability.

Technical Specifications

Power Field Effect Transistors (FET) NVMFWS0D7N04XMT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

987 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

331 A

Maximum Drain-Source On Resistance:

.0007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

112 pF

JESD-30 Code:

R-PDSO-F5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NVMFWS0D7N04XMT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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