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NVMFS6B75NLT1G

Onsemi

NVMFS6B75NLT1G by Onsemi

NVMFS6B75NLT1G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 141A IDM, and 0.046 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,024 parts In-Stock

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Digiode

USA . 2,253 parts In-Stock

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AZTECH Wire

Italy . 1,051 parts In-Stock

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$18.190

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 7,833 parts In-Stock

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TANS Electronics

Latvia . 6,413 parts In-Stock

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SupplyDigital Components

Austria . 5,879 parts In-Stock

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Kulean Microsystems

USA . 3,184 parts In-Stock

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Problanco Electronics

Mexico . 2,729 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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Corohmni

South Africa . 270 parts In-Stock

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Overview

Discover the NVMFS6B75NLT1G by Onsemi, a top-tier Power Field Effect Transistor with unparalleled quality and reliability. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL FET offers outstanding performance in various applications. With a built-in diode and small outline package style, this transistor provides maximum efficiency and power dissipation up to 56W. Ideal for enhancement mode operation, this product is designed to withstand extreme temperatures and deliver exceptional results. Elevate your projects with the NVMFS6B75NLT1G and experience the innovation and value that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package lightweight and durable, ensuring optimal performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for efficient current flow and high performance in various power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies the circuit design and enhances the overall functionality of the power FET.

Surface Mount: YES

The surface mount capability makes installation and connection convenient, saving time and effort.

Minimum DS Breakdown Voltage: 100 V

High breakdown voltage ensures reliable operation and protection against voltage spikes.

Maximum Pulsed Drain Current (IDM): 141 A

High pulsed drain current capacity allows for handling sudden power surges and peaks effectively.

Avalanche Energy Rating (EAS): 177 mJ

High avalanche energy rating ensures the power FET can withstand sudden voltage spikes or transient events without damage.

Maximum Drain Current (Abs) (ID): 28 A

High maximum drain current capacity enables efficient power transfer and handling of high current loads.

Maximum Power Dissipation (Abs): 56 W

High power dissipation rating ensures the power FET can handle high power levels without overheating or damage.

Maximum Operating Temperature: 175 °C

Wide operating temperature range allows for performance in various thermal conditions, ensuring versatility and reliability.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B75NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

177 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

141 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B75NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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