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NVMFS6B14NWFT3G

Onsemi

NVMFS6B14NWFT3G by Onsemi

NVMFS6B14NWFT3G by Onsemi is a Power FET with 100V DS Breakdown Voltage, 140A IDM, and 0.015 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

USA . 1,509 parts In-Stock

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AZTECH Wire

Italy . 194 parts In-Stock

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$19.470

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Component Stockers USA

USA . 795 parts In-Stock

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$99.990

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Perfect Parts

USA . 23,176 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,882 parts In-Stock

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Kulean Microsystems

USA . 6,827 parts In-Stock

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Problanco Electronics

Mexico . 5,042 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,050 parts In-Stock

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Corohmni

South Africa . 356 parts In-Stock

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SupplyDigital Components

Austria . 335 parts In-Stock

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UHIMA Technologies

Türkiye . 271 parts In-Stock

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Overview

Unlock the power of innovation with the NVMFS6B14NWFT3G by Onsemi. As a leader in the industry, Onsemi brings you a high-quality Power Field Effect Transistor (FET) that is designed to exceed your expectations. With applications in a wide range of industries, this N-CHANNEL FET offers unparalleled performance and reliability. Say goodbye to limitations and hello to endless possibilities with the NVMFS6B14NWFT3G. Experience the value, benefits, and advantages that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds, making this transistor ideal for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier and more efficient circuit design, saving space and simplifying the overall setup.

Surface Mount: YES

Surface mount capability makes it easy to integrate this FET into modern circuit designs, where space-saving is important.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages without risking damage, providing reliability and safety.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to mount and secure the FET onto a circuit board, ensuring stability during operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to use in most applications and offer better control over the flow of current, increasing efficiency.

Maximum Pulsed Drain Current (IDM): 140 A

High pulsed drain current rating allows this transistor to handle sudden spikes in current without failure, improving reliability under heavy loads.

Avalanche Energy Rating (EAS): 29 mJ

With a high avalanche energy rating, this FET can withstand short high-energy pulses, making it suitable for demanding industrial applications.

Maximum Drain Current (Abs) (ID): 55 A

High drain current rating allows this transistor to handle high continuous current flows, ensuring stable operation in power circuits.

No. of Terminals: 5

Having 5 terminals provides flexibility in connecting the FET to external circuits, allowing for various configurations and control options.

Maximum Power Dissipation (Abs): 94 W

High power dissipation rating ensures that this FET can handle heat generated during operation, maintaining performance over extended periods.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the circuit board, making it suitable for compact and densely populated electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low on-resistance and high switching speeds, making this FET efficient and suitable for high-frequency applications.

Maximum Operating Temperature: 175 °C

With a high operating temperature range, this FET can perform reliably in harsh conditions and high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides good performance and reliability in electronic devices, ensuring consistent operation and longevity.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows this FET to function in cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and resistance to oxidation, ensuring secure connections and long-term reliability.

Maximum Drain Current (ID): 11 A

High drain current rating allows this transistor to handle high current loads, making it suitable for power electronics and motor control applications.

Maximum Drain-Source On Resistance: 0.015 ohm

Low on-resistance minimizes power losses and improves efficiency in power applications, leading to better performance and reduced heating.

Terminal Position: DUAL

Dual terminal position provides multiple connection options, allowing for flexibility in circuit design and layout.

Case Connection: DRAIN

Having the case connection at the drain terminal simplifies circuit design and enhances thermal performance in high-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, this FET is easier to solder and less prone to heat-related damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and proper thermal bonding during manufacturing processes.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures that this FET meets stringent automotive industry requirements for quality and reliability.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS6B14NWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

29 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

55 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.015 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

140 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS6B14NWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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