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NVMFS5C670NLT3G

Onsemi

NVMFS5C670NLT3G by Onsemi

NVMFS5C670NLT3G by Onsemi is a Power FET with 60V DS Breakdown Voltage, 0.0088 ohm RDS(on), and 440A IDM. Ideal for automotive applications due to AEC-Q101 compliance, it features an N-CHANNEL configuration in a PLASTIC/EPOXY package with built-in diode.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,805 parts In-Stock

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Digiode

USA . 2,307 parts In-Stock

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Bristol Electronics

USA . 1,852 parts In-Stock

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AZTECH Wire

Italy . 295 parts In-Stock

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Problanco Electronics

Mexico . 8,326 parts In-Stock

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TANS Electronics

Latvia . 8,182 parts In-Stock

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Kulean Microsystems

USA . 6,821 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 1,512 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 401 parts In-Stock

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Corohmni

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Overview

Enhance your power management solutions with the NVMFS5C670NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like this one, designed for high-performance applications. With a single configuration and built-in diode, this N-channel transistor offers unparalleled reliability and efficiency. Ideal for various electronic devices, this transistor provides customers with superior functionality and value. Upgrade your projects today with the NVMFS5C670NLT3G from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good thermal conductivity and insulation properties, ensuring reliable operation and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-state resistance and better performance compared to P-channel FETs, making them a preferred choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easier and more efficient circuit design, reducing the need for additional components.

Surface Mount: YES

Surface mount packaging enables easy and efficient PCB assembly, saving space and reducing overall system footprint.

Minimum DS Breakdown Voltage: 60 V

High breakdown voltage rating ensures reliable operation and protection against voltage spikes and transients.

Maximum Pulsed Drain Current (IDM): 440 A

High pulsed drain current rating allows for handling large currents during peak load conditions, making it suitable for power applications.

Avalanche Energy Rating (EAS): 166 mJ

High avalanche energy rating means the FET can withstand high energy transient events, ensuring robust performance in harsh operating conditions.

Transistor Element Material: SILICON

Silicon-based FETs offer good performance characteristics such as lower ON-state resistance, high switching speed, and good thermal conductivity.

Maximum Drain-Source On Resistance: 0.0088 ohm

Low ON-state resistance results in lower conduction losses, leading to improved efficiency and reduced heat generation.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 automotive reliability standard ensures high quality and reliability, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C670NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

166 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

440 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C670NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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