Loading...

NVMFS5C468NLWFT1G

Onsemi

NVMFS5C468NLWFT1G by Onsemi

NVMFS5C468NLWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 190A IDM, and 0.0176 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,080

-

-

-

-

Digiode

USA . 967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

967

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 214 parts In-Stock

1+ parts

$3.453

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$3.453

-

-

-

AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$19.640

100+ parts

-

1k+ parts

-

10k+ parts

-

610

$19.640

-

-

-

SupplyDigital Components

Austria . 5,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,172

-

-

-

-

TANS Electronics

Latvia . 3,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,875

-

-

-

-

Problanco Electronics

Mexico . 2,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,572

-

-

-

-

Kulean Microsystems

USA . 924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

924

-

-

-

-

UHIMA Technologies

Türkiye . 533 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

533

-

-

-

-

Corphita

USA . 477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

477

-

-

-

-

Corohmni

South Africa . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

155

-

-

-

-

Overview

Unleash the power of innovation with the NVMFS5C468NLWFT1G by Onsemi. As a leader in Power Field Effect Transistors (FET), Onsemi sets the standard for quality and reliability. This N-CHANNEL transistor offers unparalleled performance with a built-in diode, making it ideal for a wide range of applications. From enhancing efficiency to maximizing power dissipation, this transistor delivers exceptional value and benefits to customers. Trust Onsemi to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a durable and protective casing for the FET, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance and efficiency compared to P-Channel FETs, making this product a reliable choice for power applications.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures that the FET can handle high levels of voltage, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.0176 ohm

The low on-resistance minimizes power losses and improves efficiency in power applications.

Maximum Power Dissipation (Abs): 28 W

With a high power dissipation rating, this FET can handle significant power loads without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C468NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

95 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

37 A

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.0176 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

190 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C468NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20