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NVMFS5C460NLWFAFT3G

Onsemi

NVMFS5C460NLWFAFT3G by Onsemi

NVMFS5C460NLWFAFT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 396A IDM, and 0.0072 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance.

Median Price

$0.730

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 80,000 parts In-Stock

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DigiKey

USA . 75,000 parts In-Stock

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$0.730

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75,000

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$0.730

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Distributors (In-Stock)

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Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$0.816

100+ parts

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88

$0.816

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ComSIT Distribution GmbH

Germany . 307,500 parts In-Stock

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Flip Electronics

USA . 75,000 parts In-Stock

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Vyrian

USA . 5,580 parts In-Stock

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5,580

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Digiode

USA . 1,782 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,972 parts In-Stock

1+ parts

$0.382

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1,972

$0.382

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Corohmni

South Africa . 444 parts In-Stock

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$0.784

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444

$0.784

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Argo Parts USA

USA . 4,339 parts In-Stock

1+ parts

$0.816

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4,339

$0.816

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Continental Prestige Electronics

USA . 3,913 parts In-Stock

1+ parts

$0.816

100+ parts

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$0.800

3,913

$0.816

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$0.800

Microchip USA

USA . 4,787 parts In-Stock

1+ parts

$4.477

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4,787

$4.477

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Ampacity Inc.

Singapore . 79,698 parts In-Stock

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$8.050

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$8.050

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AZTECH Wire

Italy . 275 parts In-Stock

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$20.730

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275

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Lixinc

USA . 10,924 parts In-Stock

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TANS Electronics

Latvia . 7,808 parts In-Stock

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Problanco Electronics

Mexico . 6,976 parts In-Stock

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Kulean Microsystems

USA . 6,186 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Corphita

USA . 1,827 parts In-Stock

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SupplyDigital Components

Austria . 1,449 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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UHIMA Technologies

Türkiye . 770 parts In-Stock

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770

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Netroflash

USA . 100 parts In-Stock

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$0.800

1k+ parts

$0.775

10k+ parts

$0.759

100

-

$0.800

$0.775

$0.759

Overview

Enhance your power management solutions with the NVMFS5C460NLWFAFT3G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their Power Field Effect Transistors. Ideal for various applications, this N-CHANNEL transistor offers high efficiency and performance. With a unique configuration and robust design, customers can benefit from its enhanced power dissipation capabilities and maximum drain current. Experience the value and advantages that the NVMFS5C460NLWFAFT3G brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Minimum DS Breakdown Voltage: 40 V

The high breakdown voltage ensures that the FET can handle high voltages without damage, making it reliable in demanding conditions.

Maximum Pulsed Drain Current (IDM): 396 A

The high pulsed drain current rating allows the FET to handle large transient currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 50 W

The high power dissipation capability ensures that the FET can effectively dissipate heat, enhancing its overall performance and reliability.

Maximum Operating Temperature: 175 °C

The high operating temperature range makes the FET suitable for use in environments with elevated temperatures, increasing its versatility.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C460NLWFAFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

107 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

78 A

Maximum Drain Current (ID):

78 A

Maximum Drain-Source On Resistance:

.0072 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

22 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

396 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C460NLWFAFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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