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NVMFS5C450NLWFT1G

Onsemi

NVMFS5C450NLWFT1G by Onsemi

NVMFS5C450NLWFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 740A IDM, and 0.0044 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 compliance. Operating in the temperature range of -55 to 175 °C, it offers high power dissipation at 68W.

Median Price

$0.400

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,900 parts In-Stock

1+ parts

$0.400

100+ parts

$0.390

1k+ parts

$0.380

10k+ parts

-

2,900

$0.400

$0.390

$0.380

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Distributors (In-Stock)

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Digiode

USA . 366 parts In-Stock

1+ parts

$0.380

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366

$0.380

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Vyrian

USA . 5,633 parts In-Stock

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5,633

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Flip Electronics

USA . 4,600 parts In-Stock

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4,600

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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ACDS - Activité Composants Distribution Service

France . 175 parts In-Stock

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175

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Distributors (Availability)

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Corphita

USA . 669 parts In-Stock

1+ parts

$0.360

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669

$0.360

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Corohmni

South Africa . 102 parts In-Stock

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$0.400

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102

$0.400

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Microchip USA

USA . 275 parts In-Stock

1+ parts

$3.365

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275

$3.365

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AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$10.930

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762

$10.930

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SupplyDigital Components

Austria . 6,281 parts In-Stock

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6,281

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Kulean Microsystems

USA . 6,103 parts In-Stock

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6,103

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 2,657 parts In-Stock

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2,657

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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TANS Electronics

Latvia . 1,009 parts In-Stock

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1,009

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UHIMA Technologies

Türkiye . 424 parts In-Stock

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424

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Overview

Discover the power of the NVMFS5C450NLWFT1G by Onsemi, a top-tier manufacturer in the field of Power Field Effect Transistors. This N-CHANNEL FET promises exceptional quality and performance with its innovative design, built-in diode, and high DS Breakdown Voltage of 40V. Ideal for a wide range of applications, this transistor offers customers the value of reliability, efficiency, and robustness, making it the perfect choice for your next project. Experience the difference with Onsemi's cutting-edge technology and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protects the internal components from damage, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance, efficiency, and reliability compared to P-channel FETs, making this product a preferred choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from reverse voltage spikes, enhancing the product's overall reliability and safety.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and cost in production processes.

Minimum DS Breakdown Voltage: 40 V

Suitable for handling high voltage applications, ensuring proper functionality and protection against voltage surges.

Maximum Pulsed Drain Current (IDM): 740 A

High current handling capacity allows the product to support demanding power requirements, making it ideal for heavy-duty applications.

Maximum Power Dissipation (Abs): 68 W

Efficiently dissipates heat generated during operation, preventing overheating and enhancing the product's overall performance and reliability.

Maximum Operating Temperature: 175 °C

Can operate effectively in high-temperature environments, offering reliable performance in various applications.

Maximum Drain-Source On Resistance: 0.0044 ohm

Low on-resistance results in minimal power loss and heat generation, improving the efficiency and overall performance of the product.

Reference Standard: AEC-Q101

Compliance with automotive quality standards ensures that the product meets strict requirements for reliability and performance in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C450NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

215 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

110 A

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0044 ohm

Field Effect Transistor Technology:

METAL SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

42 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

740 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C450NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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