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NVMFS5C430NLT1G

Onsemi

NVMFS5C430NLT1G by Onsemi

NVMFS5C430NLT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0022 ohm RDS(on). It is an N-CHANNEL MOSFET in PLASTIC/EPOXY package for applications like automotive electronics due to AEC-Q101 standard compliance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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EBV Elektronik

Germany . 1,500 parts In-Stock

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Vyrian

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Flip Electronics

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Digiode

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Microchip USA

USA . 4,570 parts In-Stock

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AZTECH Wire

Italy . 722 parts In-Stock

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Kepictronics

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Perfect Parts

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Corphita

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Kulean Microsystems

USA . 1,626 parts In-Stock

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TANS Electronics

Latvia . 1,038 parts In-Stock

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UHIMA Technologies

Türkiye . 369 parts In-Stock

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Problanco Electronics

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Corohmni

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SupplyDigital Components

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Overview

Enhance your power management system with the high-quality NVMFS5C430NLT1G by Onsemi. Designed for efficiency and reliability, this N-channel Power FET offers a single configuration with a built-in diode, making it ideal for various applications. With a maximum pulsed drain current of 900 A and an avalanche energy rating of 493 mJ, this transistor ensures optimal performance. Trust in Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your projects with the NVMFS5C430NLT1G and experience the benefits of enhanced power control and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides good insulation properties and helps in reducing the overall weight of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher electron mobility, making them more efficient for power applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto PCBs, making the installation process hassle-free.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40 V, this FET can handle higher voltages and is suitable for a wide range of applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate to turn on, offering better control over the switching behavior of the transistor.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating of 900 A ensures that this FET can handle temporary high power demands without failing.

Avalanche Energy Rating (EAS): 493 mJ

The high avalanche energy rating of 493 mJ indicates that this FET can withstand sudden voltage spikes and surges without damage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high electron mobility and low leakage currents, making this FET suitable for high-efficiency applications.

Maximum Drain-Source On Resistance: 0.0022 ohm

The low on-resistance of 0.0022 ohm results in minimal power loss and heat generation, making this FET highly efficient for power management.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 automotive standard ensures that this FET meets the stringent quality and reliability requirements for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C430NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

493 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain-Source On Resistance:

.0022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C430NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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