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NVMFS5C426NWFT3G

Onsemi

NVMFS5C426NWFT3G by Onsemi

NVMFS5C426NWFT3G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 235A Drain Current, and 0.0013 ohm On Resistance. It is an N-CHANNEL MOSFET in a PLASTIC/EPOXY package suitable for automotive applications due to its AEC-Q101 compliance and high power dissipation of 128W.

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1k+

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Vyrian

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Digiode

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Nova Conductors

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Microchip USA

USA . 445 parts In-Stock

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AZTECH Wire

Italy . 1,080 parts In-Stock

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Semicontronic

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$37.050

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$35.938

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Ampacity Inc.

Singapore . 43,115 parts In-Stock

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Kulean Microsystems

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Argo Parts USA

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Overview

Experience the power of innovation with the NVMFS5C426NWFT3G by Onsemi. This high-quality Power Field Effect Transistor (FET) offers exceptional performance and reliability, making it ideal for a wide range of applications. With a single configuration and built-in diode, this N-channel transistor provides customers with value and benefits like never before. Trust in Onsemi's expertise and bring your projects to the next level with the NVMFS5C426NWFT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel type provides efficient operation and allows for easy integration into circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and enhances overall functionality of the product.

Surface Mount: YES

Surface mount capability enables easy and space-saving installation on circuit boards.

Minimum DS Breakdown Voltage: 40 V

High minimum breakdown voltage ensures reliable performance and protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and soldering on PCBs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides improved control and efficiency in power management.

Maximum Pulsed Drain Current (IDM): 900 A

High pulsed drain current rating allows for handling of heavy loads and peak power requirements.

Avalanche Energy Rating (EAS): 739 mJ

High avalanche energy rating indicates robustness and reliability under high energy conditions.

Maximum Drain Current (Abs) (ID): 235 A

High maximum drain current capacity enables the transistor to handle large current flows without damage.

No. of Terminals: 5

5 terminals provide ample connectivity options for various circuit configurations.

Maximum Power Dissipation (Abs): 128 W

High power dissipation rating indicates the ability of the transistor to handle power efficiently.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers improved performance and reliability in power switching applications.

Maximum Operating Temperature: 175 °C

High operating temperature range allows for reliable performance in a variety of environments.

Transistor Element Material: SILICON

Silicon material provides high conductivity and efficiency in power management.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures the transistor can function in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good electrical conductivity and solderability for reliable connections.

Maximum Drain-Source On Resistance: 0.0013 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in power switching applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and layout.

Case Connection: DRAIN

Drain case connection simplifies installation and improves thermal management of the transistor.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time requirement makes it easy to integrate the transistor into manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the transistor can withstand soldering processes effectively.

Maximum Feedback Capacitance (Crss): 59 pF

Low feedback capacitance minimizes feedback effects and improves overall stability in circuits.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standard ensures high quality and reliability for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C426NWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

739 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

235 A

Maximum Drain Current (ID):

235 A

Maximum Drain-Source On Resistance:

.0013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

59 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C426NWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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