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NVMFS5C423NLWFT3G

Onsemi

NVMFS5C423NLWFT3G by Onsemi

NVMFS5C423NLWFT3G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 900A IDM, and 0.003 ohm RDS(on). Ideal for power management applications in automotive industry due to AEC-Q101 compliance and 175 °C max operating temp.

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2

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1k+

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Vyrian

USA . 7,469 parts In-Stock

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Digiode

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Microchip USA

USA . 2,881 parts In-Stock

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AZTECH Wire

Italy . 45 parts In-Stock

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SupplyDigital Components

Austria . 7,613 parts In-Stock

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Kulean Microsystems

USA . 6,158 parts In-Stock

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TANS Electronics

Latvia . 5,821 parts In-Stock

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Corphita

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Problanco Electronics

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UHIMA Technologies

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Corohmni

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Overview

Unleash the power of innovation with the NVMFS5C423NLWFT3G by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance and reliability in a variety of applications. From automotive to industrial, this N-channel transistor with a built-in diode is designed to exceed expectations. Experience seamless operation and maximum efficiency with its enhancement mode configuration and impressive 900A maximum pulsed drain current. Trust Onsemi to deliver cutting-edge technology that empowers your projects to soar to new heights. Elevate your designs with the NVMFS5C423NLWFT3G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs offer faster switching speeds and lower ON resistance compared to P-Channel FETs, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of safety to the circuit.

Surface Mount: YES

Surface mount technology enables easy PCB assembly, saving space and reducing assembly time.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, providing better control over the flow of current in the circuit.

Maximum Pulsed Drain Current (IDM): 900 A

The high pulsed drain current rating allows the FET to handle surge currents without getting damaged, making it suitable for high power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB space and allows for higher component density in the design.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, the FET can handle elevated temperatures without performance degradation, ensuring reliable operation in harsh environments.

Maximum Power Dissipation (Abs): 83 W

The high power dissipation rating allows the FET to handle significant power loads, suitable for high power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON resistance and fast switching speeds, making it efficient for power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures proper soldering of the FET during assembly, resulting in reliable electrical connections.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures the FET meets automotive-grade requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C423NLWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.003 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C423NLWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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