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NVMFS5C410NLWFAFT1G

Onsemi

NVMFS5C410NLWFAFT1G by Onsemi

NVMFS5C410NLWFAFT1G by Onsemi is a Power FET with 40V DS Breakdown Voltage, 900A IDM, and 0.0012 ohm RDS(on). Ideal for automotive applications due to AEC-Q101 standard compliance. Enhances performance in power management systems with its high current handling capabilities.

Median Price

$5.300

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,303 parts In-Stock

1+ parts

$5.300

100+ parts

$2.530

1k+ parts

$2.270

10k+ parts

-

1,303

$5.300

$2.530

$2.270

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DigiKey

USA . 256 parts In-Stock

1+ parts

$5.300

100+ parts

$2.523

1k+ parts

$2.424

10k+ parts

$1.980

256

$5.300

$2.523

$2.424

$1.980

Chip1Stop

Japan . 1,150 parts In-Stock

1+ parts

$14.000

100+ parts

$5.750

1k+ parts

$3.700

10k+ parts

-

1,150

$14.000

$5.750

$3.700

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.574

100+ parts

-

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500

$2.574

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Digiode

USA . 298 parts In-Stock

1+ parts

$4.123

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298

$4.123

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Vyrian

USA . 5,820 parts In-Stock

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5,820

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Flip Electronics

USA . 4,500 parts In-Stock

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4,500

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NAC Semi

USA . 1,500 parts In-Stock

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$3.880

1,500

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$3.880

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 91 parts In-Stock

1+ parts

$2.522

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-

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91

$2.522

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.574

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100

$2.574

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

1+ parts

$3.690

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1,031

$3.690

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Corphita

USA . 743 parts In-Stock

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$3.906

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743

$3.906

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Microchip USA

USA . 6,401 parts In-Stock

1+ parts

$15.279

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6,401

$15.279

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Lixinc

USA . 10,891 parts In-Stock

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10,891

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

Austria . 4,742 parts In-Stock

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TANS Electronics

Latvia . 4,637 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,286 parts In-Stock

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iodParts Technologies Inc.

India . 1,350 parts In-Stock

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Kulean Microsystems

USA . 1,325 parts In-Stock

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UHIMA Technologies

Türkiye . 557 parts In-Stock

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557

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Overview

Unleash the power of innovation with the NVMFS5C410NLWFAFT1G by Onsemi. Crafted with precision and quality, this Power Field Effect Transistor (FET) offers unrivaled performance and reliability. Ideal for a wide range of applications, this N-CHANNEL transistor with a built-in diode delivers exceptional value and benefits to customers. From its enhanced mode operation to its high drain current capacity, this product is designed to exceed expectations. Elevate your projects with the cutting-edge technology of Onsemi's NVMFS5C410NLWFAFT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs usually have better performance and efficiency compared to P-channel FETs, making this product a favorable choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for better protection against voltage spikes and reverse polarity, enhancing the reliability of the FET.

Surface Mount: YES

Being surface mountable makes the installation of this FET easier and more convenient, especially in compact electronic designs.

Minimum DS Breakdown Voltage: 40 V

The minimum breakdown voltage of 40V ensures reliable operation within specified voltage ranges, making it suitable for various power applications.

Maximum Pulsed Drain Current (IDM): 900 A

With a high pulsed drain current rating, this FET is capable of handling power surges and transient conditions effectively.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation capability allows the FET to operate efficiently under high load conditions, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, making it suitable for harsh environments.

Maximum Feedback Capacitance (Crss): 116 pF

The low feedback capacitance helps reduce signal distortion and improves high-frequency performance, making this FET ideal for fast-switching applications.

Reference Standard: AEC-Q101

Conforming to the AEC-Q101 standard ensures that this FET meets stringent automotive quality and reliability requirements, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C410NLWFAFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

706 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

330 A

Maximum Drain Current (ID):

330 A

Maximum Drain-Source On Resistance:

.0012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

116 pF

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

900 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5C410NLWFAFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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