Loading...

NVMFS5C410NLT1G

Onsemi

NVMFS5C410NLT1G by Onsemi

NVMFS5C410NLT1G by Onsemi is a N-CHANNEL FET with 315A ID and 167W power dissipation. Ideal for high-power applications, it operates up to 175 °C with METAL-OXIDE SEMICONDUCTOR tech. Suitable for surface mount designs, it features matte tin finish and peak reflow temp of 260°C.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,862

-

-

-

-

Bristol Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$1.620

1k+ parts

$1.423

10k+ parts

-

6,000

-

$1.620

$1.423

-

Flip Electronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Digiode

USA . 597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

597

-

-

-

-

Microfarads

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

420

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 5,787 parts In-Stock

1+ parts

$9.559

100+ parts

-

1k+ parts

-

10k+ parts

-

5,787

$9.559

-

-

-

AZTECH Wire

Italy . 1,197 parts In-Stock

1+ parts

$18.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,197

$18.820

-

-

-

Component Stockers USA

USA . 575 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

575

$99.990

-

-

-

Perfect Parts

USA . 64,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

64,275

-

-

-

-

Problanco Electronics

Mexico . 7,771 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,771

-

-

-

-

Kepictronics

USA . 5,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,995

-

-

-

-

SupplyDigital Components

Austria . 5,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,839

-

-

-

-

Kulean Microsystems

USA . 1,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,775

-

-

-

-

TANS Electronics

Latvia . 1,513 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,513

-

-

-

-

Corphita

USA . 485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

485

-

-

-

-

Corohmni

South Africa . 119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

119

-

-

-

-

UHIMA Technologies

Türkiye . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Overview

Looking for high-quality and reliable power field-effect transistors? Look no further than the NVMFS5C410NLT1G by Onsemi. With a maximum drain current of 315 A and a maximum power dissipation of 167 W, this N-channel FET is perfect for a wide range of applications. From automotive to industrial use, this single-configured transistor offers exceptional performance and efficiency. Trust Onsemi's expertise in metal-oxide semiconductor technology to deliver top-notch products that meet your needs. Upgrade your designs with the NVMFS5C410NLT1G and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speed, making them a good choice for high-performance applications.

Configuration: SINGLE

Single configuration FETs are simple to use and suitable for basic power switching applications.

Surface Mount: YES

Surface mount FETs are space-saving and easy to assemble on circuit boards, making them ideal for compact designs.

Maximum Drain Current (Abs) (ID): 315 A

With a high maximum drain current, this FET can handle heavy loads and provide reliable power control.

Maximum Power Dissipation (Abs): 167 W

The high power dissipation capability allows for efficient heat dissipation, ensuring the FET can operate at high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET suitable for a wide range of applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures the FET can withstand high-temperature environments without performance degradation.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability, while the annealed treatment enhances the durability of the terminal finish.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent thermal damage during assembly, ensuring the FET remains reliable.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering during assembly, ensuring the FET remains securely attached to the circuit board.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C410NLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

315 A

Maximum Drain Current (ID):

315 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C410NLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20