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NVMFS5C404NLT3G

Onsemi

NVMFS5C404NLT3G by Onsemi

NVMFS5C404NLT3G by Onsemi is a single N-channel Power FET with 352A max drain current and 200W max power dissipation. Utilizes metal-oxide semiconductor technology, operates up to 175°C, making it ideal for high-power applications in automotive and industrial sectors.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,843 parts In-Stock

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4,843

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Digiode

USA . 2,213 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 228 parts In-Stock

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$0.589

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228

$0.589

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Ampacity Inc.

Singapore . 285 parts In-Stock

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$3.050

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285

$3.050

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AZTECH Wire

Italy . 438 parts In-Stock

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$9.838

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Microchip USA

USA . 9,938 parts In-Stock

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$10.465

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$10.465

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Kulean Microsystems

USA . 7,888 parts In-Stock

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Continental Prestige Electronics

USA . 5,818 parts In-Stock

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TANS Electronics

Latvia . 3,256 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,026 parts In-Stock

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Argo Parts USA

USA . 2,946 parts In-Stock

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SupplyDigital Components

Austria . 2,819 parts In-Stock

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Problanco Electronics

Mexico . 1,203 parts In-Stock

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Corphita

USA . 1,004 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 216 parts In-Stock

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Corohmni

South Africa . 213 parts In-Stock

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Overview

Experience the power of superior performance with the NVMFS5C404NLT3G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers quality and reliability in every product, making it the top choice for Power Field Effect Transistors. Ideal for a wide range of applications, this N-CHANNEL FET offers maximum efficiency and power dissipation, ensuring optimal performance in any project. Trust in Onsemi to provide the value and benefits you need to take your designs to the next level.

Feature Benefit Bullets

Polarity or Channel Type

N-CHANNEL - N-channel FETs are known for their high performance and efficiency, making them suitable for high-power applications.

Configuration

SINGLE - Single configuration FETs are easy to use and integrate into circuits, simplifying the design process.

Surface Mount

YES - Surface mount FETs save PCB space and provide better thermal performance compared to through-hole components.

Maximum Drain Current (ID)

352 A - High maximum drain current allows for handling of large amounts of power, making this FET suitable for high-power applications.

Maximum Power Dissipation (P)

200 W - High power dissipation allows the FET to handle high power levels without overheating, ensuring reliable operation.

Field Effect Transistor Technology

METAL-OXIDE SEMICONDUCTOR - MOSFET technology offers high switching speeds and low on-state resistance for efficient power handling.

Maximum Operating Temperature

175 °C - High maximum operating temperature allows for reliable performance in demanding environments.

Terminal Finish

MATTE TIN - Matte tin finish provides good solderability and corrosion resistance, ensuring lasting connections.

Maximum Time At Peak Reflow Temperature

30 s - Short time at peak reflow temperature minimizes the risk of thermal damage during soldering.

Peak Reflow Temperature

260 C - High peak reflow temperature ensures proper soldering and reliability of the connection.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5C404NLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

352 A

Maximum Drain Current (ID):

352 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5C404NLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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