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NVMFS5A160PLZWFT3G

Onsemi

NVMFS5A160PLZWFT3G by Onsemi

NVMFS5A160PLZWFT3G by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, 400A IDM, and 0.0105 ohm RDS. It's used in automotive applications due to AEC-Q101 standard compliance and can operate b/w -55 to 175 °C for enhanced performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,831 parts In-Stock

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Digiode

USA . 717 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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AZTECH Wire

Italy . 271 parts In-Stock

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$7.434

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

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$10.050

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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TANS Electronics

Latvia . 6,736 parts In-Stock

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Kulean Microsystems

USA . 5,993 parts In-Stock

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SupplyDigital Components

Austria . 5,813 parts In-Stock

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Problanco Electronics

Mexico . 3,953 parts In-Stock

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Corphita

USA . 1,582 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 800 parts In-Stock

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Corohmni

South Africa . 434 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Overview

Discover the power and efficiency of the NVMFS5A160PLZWFT3G by Onsemi, a top-of-the-line P-Channel Power Field Effect Transistor with a built-in diode. This high-quality component is a game-changer in the world of electronics, offering reliable performance and durability. Ideal for a wide range of applications, this transistor is a must-have for any project requiring enhanced power management. Trust Onsemi's expertise and innovation to deliver cutting-edge technology that brings value and benefits to your designs. Elevate your creations with the NVMFS5A160PLZWFT3G and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: P-CHANNEL

Suitable for applications requiring P-channel FETs, allowing for easy integration into existing circuit designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by combining the functionality of a FET with a diode.

Surface Mount: YES

Facilitates easy and efficient PCB assembly processes.

Minimum DS Breakdown Voltage: 60 V

Ensures reliable operation within the specified voltage range.

Package Shape: RECTANGULAR

Allows for efficient placement on the PCB for space-saving designs.

Operating Mode: ENHANCEMENT MODE

Offers control over the FET's conducting state, enhancing flexibility in circuit design.

Maximum Pulsed Drain Current (IDM): 400 A

Handles high current loads, suitable for power applications.

Avalanche Energy Rating (EAS): 335 mJ

Capable of withstanding high energy levels, enhancing reliability in rugged environments.

No. of Terminals: 5

Provides necessary connections for input, output, and control signals.

Package Style (Meter): SMALL OUTLINE

Saves space on the PCB, suitable for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers efficient switching performance and high gain characteristics.

Maximum Operating Temperature: 175 °C

Operates reliably in elevated temperature environments.

Transistor Element Material: SILICON

Known for its high thermal conductivity and reliability in electronic devices.

Minimum Operating Temperature: -55 °C

Functions effectively in low-temperature conditions, suitable for diverse applications.

Terminal Finish: Matte Tin (Sn) - annealed

Provides corrosion resistance and ensures reliable electrical connections.

Maximum Drain-Source On Resistance: 0.0105 ohm

Minimizes power loss and heat dissipation during operation.

Terminal Position: DUAL

Allows for flexibility in board layout and connection schemes.

Case Connection: DRAIN

Simplifies connections and enhances ease of use in circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures component reliability during the reflow soldering process.

Peak Reflow Temperature °C: 260

Meets industry standards for lead-free soldering processes.

Reference Standard: AEC-Q101

Complies with automotive quality standards, suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5A160PLZWFT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

335 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain-Source On Resistance:

.0105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5A160PLZWFT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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