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NVMFS5885NLWFT1G

Onsemi

NVMFS5885NLWFT1G by Onsemi

NVMFS5885NLWFT1G by Onsemi is a N-CHANNEL FET with 39A max drain current and 54W power dissipation. Ideal for high-power applications, it operates up to 175 °C, making it suitable for industrial use in harsh environments. Its single configuration and surface mount design enhance ease of integration in various power systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 63,000 parts In-Stock

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Flip Electronics

USA . 12,000 parts In-Stock

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Vyrian

USA . 5,402 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 517 parts In-Stock

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$16.920

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Problanco Electronics

Mexico . 8,072 parts In-Stock

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SupplyDigital Components

Austria . 7,749 parts In-Stock

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Kulean Microsystems

USA . 5,720 parts In-Stock

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TANS Electronics

Latvia . 432 parts In-Stock

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Corohmni

South Africa . 355 parts In-Stock

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UHIMA Technologies

Türkiye . 71 parts In-Stock

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Overview

Enhance the efficiency of your power management system with the NVMFS5885NLWFT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Field Effect Transistors (FET) like no other. This N-CHANNEL FET offers a maximum drain current of 39A and a maximum power dissipation of 54W, making it ideal for a wide range of applications. With its innovative METAL-OXIDE SEMICONDUCTOR technology and reliable matte tin terminal finish, this FET ensures optimal performance and durability. Upgrade your electronics today with the NVMFS5885NLWFT1G and experience superior power management like never before.

Feature Benefit Bullets

N-CHANNEL Polarity

N-CHANNEL FETs are commonly used in high-power applications due to their low on-state resistance and high current-carrying capability.

SINGLE Configuration

SINGLE configuration makes it easier to design circuits and provides simplicity in application.

Surface Mount Capability

Surface Mount technology allows for compact and lightweight designs, making it suitable for space-constrained applications.

Maximum Drain Current of 39A

High maximum drain current capability ensures that the FET can handle high current loads effectively.

Maximum Power Dissipation of 54W

High power dissipation rating allows the FET to withstand high power levels without overheating.

Metal-Oxide Semiconductor Technology

Metal-Oxide Semiconductor technology offers high switching speeds and low input capacitance for efficient performance.

Maximum Operating Temperature of 175C

High maximum operating temperature ensures reliable operation even in hot environments.

Terminal Finish of Matte Tin

Matte Tin finish provides good solderability and ensures reliable electrical connections in applications.

Maximum Time At Peak Reflow Temperature of 30s

Short reflow time allows for quick and efficient soldering processes during assembly.

Peak Reflow Temperature of 260C

High peak reflow temperature capability ensures proper soldering and reliability during assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5885NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

39 A

Maximum Drain Current (ID):

39 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5885NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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