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NVMFS5833NT1G

Onsemi

NVMFS5833NT1G by Onsemi

NVMFS5833NT1G by Onsemi is a N-CHANNEL FET with 86A ID and 112W power dissipation. Ideal for high-power applications, it operates at up to 175 °C with surface mount configuration. Suitable for various industrial and automotive uses due to its robust metal-oxide semiconductor technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

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1k+

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Vyrian

USA . 4,749 parts In-Stock

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Digiode

USA . 2,369 parts In-Stock

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AZTECH Wire

Italy . 1,196 parts In-Stock

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Perfect Parts

USA . 23,153 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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TANS Electronics

Latvia . 6,183 parts In-Stock

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Kulean Microsystems

USA . 4,270 parts In-Stock

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SupplyDigital Components

Austria . 4,046 parts In-Stock

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Corphita

USA . 2,312 parts In-Stock

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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Corohmni

South Africa . 351 parts In-Stock

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Problanco Electronics

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Overview

Unlock the power of the NVMFS5833NT1G by Onsemi, a top-of-the-line N-channel Power FET that delivers unparalleled performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this FET is perfect for a wide range of applications where efficiency and durability are key. With a maximum drain current of 86A and a power dissipation of 112W, this FET offers exceptional value and benefits to customers looking for high-quality components that deliver outstanding results. Say goodbye to compromises and hello to superior performance with the NVMFS5833NT1G.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower on-state resistance compared to P-channel FETs, making them a good choice for power applications.

Configuration: SINGLE

Single configuration FETs are easier to work with and integrate into circuits, simplifying the design and reducing potential points of failure.

Surface Mount: YES

Surface mount FETs are more compact, allowing for higher component density on circuit boards and enabling smaller overall product designs.

Maximum Drain Current (Abs) (ID): 86 A

High maximum drain current allows this FET to handle large amounts of power, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 112 W

High maximum power dissipation ensures that the FET can operate at high power levels without overheating or failing, increasing reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET suitable for various applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature allows this FET to operate in demanding environments without performance degradation, improving overall product durability.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection in the long term.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature reduces the risk of damaging the FET during assembly processes, ensuring product integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient soldering of the FET onto circuit boards, ensuring a strong and reliable connection.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5833NT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

86 A

Maximum Drain Current (ID):

86 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NVMFS5833NT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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