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NVMFS5830NLWFT1G

Onsemi

NVMFS5830NLWFT1G by Onsemi

NVMFS5830NLWFT1G by Onsemi is a N-CHANNEL FET with 40V DS Breakdown Voltage, 185A Max ID, and 0.0036 ohm RDS(ON). It's used in power applications due to its 158W Power Dissipation, 1012A IDM, and 361mJ EAS rating. Ideal for automotive industry with AEC-Q101 standard compliance.

Median Price

$0.997

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,500 parts In-Stock

1+ parts

$0.997

100+ parts

$0.937

1k+ parts

$0.847

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1,500

$0.997

$0.937

$0.847

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Distributors (In-Stock)

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Digiode

USA . 739 parts In-Stock

1+ parts

$0.947

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739

$0.947

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NAC Semi

USA . 3,000 parts In-Stock

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$1.150

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$1.150

Vyrian

USA . 2,999 parts In-Stock

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2,999

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Distributors (Availability)

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Corphita

USA . 176 parts In-Stock

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$0.897

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176

$0.897

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Corohmni

South Africa . 306 parts In-Stock

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$0.997

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306

$0.997

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AZTECH Wire

Italy . 229 parts In-Stock

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$14.090

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229

$14.090

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Problanco Electronics

Mexico . 7,687 parts In-Stock

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SupplyDigital Components

Austria . 6,663 parts In-Stock

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Kulean Microsystems

USA . 5,308 parts In-Stock

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TANS Electronics

Latvia . 3,577 parts In-Stock

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UHIMA Technologies

Türkiye . 621 parts In-Stock

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Overview

Discover the unbeatable power and efficiency of the NVMFS5830NLWFT1G by Onsemi, a top-tier manufacturer known for superior quality and innovation. As a leading player in the Power Field Effect Transistors category, this N-CHANNEL transistor offers single configuration with a built-in diode, ensuring peak performance in a variety of applications. From small outline packages to high operating temperatures, this transistor excels in enhancement mode, delivering maximum pulsing drain current and minimal on-resistance. Elevate your projects with the unmatched reliability and cutting-edge technology of the NVMFS5830NLWFT1G by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and helps protect the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse currents, enhancing the reliability of the product.

Surface Mount: YES

Being surface mountable makes this FET easy to integrate into compact electronic designs, saving space and simplifying assembly processes.

Maximum Pulsed Drain Current (IDM): 1012 A

The high maximum pulsed drain current rating allows for handling of sudden current spikes or surges, making this FET suitable for demanding applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can perform reliably in various environmental conditions without overheating.

Technical Specifications

Power Field Effect Transistors (FET) NVMFS5830NLWFT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

361 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

185 A

Maximum Drain Current (ID):

185 A

Maximum Drain-Source On Resistance:

.0036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1012 A

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NVMFS5830NLWFT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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